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C72150 Copper-nickel vs. Solder Alloy 102

C72150 copper-nickel belongs to the copper alloys classification, while solder alloy 102 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C72150 copper-nickel and the bottom bar is solder alloy 102.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 150
38
Elongation at Break, % 29
48
Poisson's Ratio 0.33
0.39
Shear Modulus, GPa 55
14
Tensile Strength: Ultimate (UTS), MPa 490
31

Thermal Properties

Latent Heat of Fusion, J/g 250
46
Melting Completion (Liquidus), °C 1210
180
Melting Onset (Solidus), °C 1250
180
Specific Heat Capacity, J/kg-K 410
190
Thermal Conductivity, W/m-K 22
53
Thermal Expansion, µm/m-K 14
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.5
12
Electrical Conductivity: Equal Weight (Specific), % IACS 3.6
13

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 6.1
11
Embodied Energy, MJ/kg 88
180
Embodied Water, L/kg 270
930

Common Calculations

Stiffness to Weight: Axial, points 9.1
2.4
Stiffness to Weight: Bending, points 20
13
Strength to Weight: Axial, points 15
1.0
Strength to Weight: Bending, points 15
2.5
Thermal Diffusivity, mm2/s 6.0
32
Thermal Shock Resistance, points 18
2.4

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.050
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.050
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.1
0
Copper (Cu), % 52.5 to 57
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.050
36 to 37.5
Manganese (Mn), % 0 to 0.050
0
Nickel (Ni), % 43 to 46
0 to 0.010
Silicon (Si), % 0 to 0.5
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
62.5 to 63.5
Zinc (Zn), % 0 to 0.2
0 to 0.0010
Residuals, % 0 to 0.5
0