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C72150 Copper-nickel vs. Solder Alloy 132

C72150 copper-nickel belongs to the copper alloys classification, while solder alloy 132 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C72150 copper-nickel and the bottom bar is solder alloy 132.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 150
37
Elongation at Break, % 29
43
Poisson's Ratio 0.33
0.39
Shear Modulus, GPa 55
13
Tensile Strength: Ultimate (UTS), MPa 490
52

Thermal Properties

Latent Heat of Fusion, J/g 250
45
Melting Completion (Liquidus), °C 1210
190
Melting Onset (Solidus), °C 1250
180
Specific Heat Capacity, J/kg-K 410
180
Thermal Conductivity, W/m-K 22
50
Thermal Expansion, µm/m-K 14
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.5
11
Electrical Conductivity: Equal Weight (Specific), % IACS 3.6
12

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 6.1
11
Embodied Energy, MJ/kg 88
180
Embodied Water, L/kg 270
910

Common Calculations

Stiffness to Weight: Axial, points 9.1
2.3
Stiffness to Weight: Bending, points 20
12
Strength to Weight: Axial, points 15
1.6
Strength to Weight: Bending, points 15
3.5
Thermal Diffusivity, mm2/s 6.0
30
Thermal Shock Resistance, points 18
4.1

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0.2 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.1
0
Copper (Cu), % 52.5 to 57
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.050
38.5 to 40.3
Manganese (Mn), % 0 to 0.050
0
Nickel (Ni), % 43 to 46
0 to 0.010
Silicon (Si), % 0 to 0.5
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
59.5 to 60.5
Zinc (Zn), % 0 to 0.2
0 to 0.0010
Residuals, % 0 to 0.5
0