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C72200 Copper-nickel vs. Solder Alloy 101

C72200 copper-nickel belongs to the copper alloys classification, while solder alloy 101 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C72200 copper-nickel and the bottom bar is solder alloy 101.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
38
Poisson's Ratio 0.33
0.39
Shear Modulus, GPa 48
14
Tensile Strength: Ultimate (UTS), MPa 350 to 580
31

Thermal Properties

Latent Heat of Fusion, J/g 220
46
Melting Completion (Liquidus), °C 1180
180
Melting Onset (Solidus), °C 1120
180
Specific Heat Capacity, J/kg-K 400
190
Thermal Conductivity, W/m-K 34
51
Thermal Expansion, µm/m-K 16
25

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.5
12
Electrical Conductivity: Equal Weight (Specific), % IACS 6.6
12

Otherwise Unclassified Properties

Density, g/cm3 8.9
8.8
Embodied Carbon, kg CO2/kg material 3.9
11
Embodied Energy, MJ/kg 59
180
Embodied Water, L/kg 300
930

Common Calculations

Stiffness to Weight: Axial, points 8.0
2.4
Stiffness to Weight: Bending, points 19
13
Strength to Weight: Axial, points 11 to 18
1.0
Strength to Weight: Bending, points 12 to 17
2.5
Thermal Diffusivity, mm2/s 9.6
31
Thermal Shock Resistance, points 12 to 20
2.4

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Chromium (Cr), % 0.3 to 0.7
0
Copper (Cu), % 78.1 to 84.2
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.5 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.050
35.8 to 37.5
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 15 to 18
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
62.5 to 63.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.2
0