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C72200 Copper-nickel vs. Solder Alloy 115

C72200 copper-nickel belongs to the copper alloys classification, while solder alloy 115 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C72200 copper-nickel and the bottom bar is solder alloy 115.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
28
Poisson's Ratio 0.33
0.41
Shear Modulus, GPa 48
10
Tensile Strength: Ultimate (UTS), MPa 350 to 580
36

Thermal Properties

Latent Heat of Fusion, J/g 220
36
Melting Completion (Liquidus), °C 1180
250
Melting Onset (Solidus), °C 1120
180
Specific Heat Capacity, J/kg-K 400
160
Thermal Conductivity, W/m-K 34
43
Thermal Expansion, µm/m-K 16
27

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.5
9.8
Electrical Conductivity: Equal Weight (Specific), % IACS 6.6
8.9

Otherwise Unclassified Properties

Base Metal Price, % relative 36
95
Density, g/cm3 8.9
9.9
Embodied Carbon, kg CO2/kg material 3.9
7.8
Embodied Energy, MJ/kg 59
130
Embodied Water, L/kg 300
730

Common Calculations

Stiffness to Weight: Axial, points 8.0
1.6
Stiffness to Weight: Bending, points 19
10
Strength to Weight: Axial, points 11 to 18
1.0
Strength to Weight: Bending, points 12 to 17
2.4
Thermal Diffusivity, mm2/s 9.6
27
Thermal Shock Resistance, points 12 to 20
3.4

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Chromium (Cr), % 0.3 to 0.7
0
Copper (Cu), % 78.1 to 84.2
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.5 to 1.0
0 to 0.020
Lead (Pb), % 0 to 0.050
63.4 to 65.5
Manganese (Mn), % 0 to 1.0
0
Nickel (Ni), % 15 to 18
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
34.5 to 35.5
Zinc (Zn), % 0 to 1.0
0 to 0.0010
Residuals, % 0 to 0.2
0