C72500 Copper-nickel vs. CC382H Copper-nickel
Both C72500 copper-nickel and CC382H copper-nickel are copper alloys. They have 76% of their average alloy composition in common. There are 24 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.
For each property being compared, the top bar is C72500 copper-nickel and the bottom bar is CC382H copper-nickel.
Metric UnitsUS Customary Units
Mechanical Properties
| Elastic (Young's, Tensile) Modulus, GPa | 120 | |
| 140 |
| Poisson's Ratio | 0.34 | |
| 0.33 |
| Shear Modulus, GPa | 45 | |
| 53 |
| Tensile Strength: Ultimate (UTS), MPa | 420 to 780 | |
| 490 |
Thermal Properties
| Latent Heat of Fusion, J/g | 210 | |
| 240 |
| Maximum Temperature: Mechanical, °C | 210 | |
| 260 |
| Melting Completion (Liquidus), °C | 1130 | |
| 1180 |
| Melting Onset (Solidus), °C | 1060 | |
| 1120 |
| Specific Heat Capacity, J/kg-K | 390 | |
| 410 |
| Thermal Conductivity, W/m-K | 54 | |
| 30 |
| Thermal Expansion, µm/m-K | 17 | |
| 15 |
Electrical Properties
| Electrical Conductivity: Equal Volume, % IACS | 11 | |
| 5.5 |
| Electrical Conductivity: Equal Weight (Specific), % IACS | 11 | |
| 5.6 |
Otherwise Unclassified Properties
| Base Metal Price, % relative | 35 | |
| 41 |
| Density, g/cm3 | 8.9 | |
| 8.9 |
| Embodied Carbon, kg CO2/kg material | 3.6 | |
| 5.2 |
| Embodied Energy, MJ/kg | 55 | |
| 76 |
| Embodied Water, L/kg | 320 | |
| 290 |
Common Calculations
| Stiffness to Weight: Axial, points | 7.6 | |
| 8.8 |
| Stiffness to Weight: Bending, points | 19 | |
| 20 |
| Strength to Weight: Axial, points | 13 to 24 | |
| 15 |
| Strength to Weight: Bending, points | 14 to 21 | |
| 16 |
| Thermal Diffusivity, mm2/s | 16 | |
| 8.2 |
| Thermal Shock Resistance, points | 14 to 27 | |
| 16 |
Alloy Composition
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| Aluminum (Al), % | 0 | |
| 0 to 0.010 |
| Bismuth (Bi), % | 0 | |
| 0 to 0.0020 |
| Boron (B), % | 0 | |
| 0 to 0.010 |
| Carbon (C), % | 0 | |
| 0 to 0.030 |
| Chromium (Cr), % | 0 | |
| 1.5 to 2.0 |
| Copper (Cu), % | 85.2 to 89.7 | |
| 62.8 to 68.4 |
| Iron (Fe), % | 0 to 0.6 | |
| 0.5 to 1.0 |
| Lead (Pb), % | 0 to 0.050 | |
| 0 to 0.0050 |
| Magnesium (Mg), % | 0 | |
| 0 to 0.010 |
| Manganese (Mn), % | 0 to 0.2 | |
| 0.5 to 1.0 |
| Nickel (Ni), % | 8.5 to 10.5 | |
| 29 to 32 |
| Phosphorus (P), % | 0 | |
| 0 to 0.010 |
| Selenium (Se), % | 0 | |
| 0 to 0.0050 |
| Silicon (Si), % | 0 | |
| 0.15 to 0.5 |
| Sulfur (S), % | 0 | |
| 0 to 0.010 |
| Tellurium (Te), % | 0 | |
| 0 to 0.0050 |
| Tin (Sn), % | 1.8 to 2.8 | |
| 0 |
| Titanium (Ti), % | 0 | |
| 0 to 0.25 |
| Zinc (Zn), % | 0 to 0.5 | |
| 0 to 0.2 |
| Zirconium (Zr), % | 0 | |
| 0 to 0.15 |
| Residuals, % | 0 to 0.2 | |
| 0 |