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C72700 Copper-nickel vs. Solder Alloy 503

C72700 copper-nickel belongs to the copper alloys classification, while solder alloy 503 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C72700 copper-nickel and the bottom bar is solder alloy 503.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
54
Elongation at Break, % 4.0 to 36
30
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 44
20
Tensile Strength: Ultimate (UTS), MPa 460 to 1070
57

Thermal Properties

Latent Heat of Fusion, J/g 210
69
Melting Completion (Liquidus), °C 1100
380
Melting Onset (Solidus), °C 930
220
Specific Heat Capacity, J/kg-K 380
230
Thermal Conductivity, W/m-K 54
61
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
14
Electrical Conductivity: Equal Weight (Specific), % IACS 11
17

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.5
Embodied Carbon, kg CO2/kg material 4.0
16
Embodied Energy, MJ/kg 62
270

Common Calculations

Stiffness to Weight: Axial, points 7.4
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 14 to 34
2.1
Strength to Weight: Bending, points 15 to 26
4.4
Thermal Diffusivity, mm2/s 16
35
Thermal Shock Resistance, points 16 to 38
3.5

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.080
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 82.1 to 86
5.5 to 6.5
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.5
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Magnesium (Mg), % 0 to 0.15
0
Manganese (Mn), % 0.050 to 0.3
0
Nickel (Ni), % 8.5 to 9.5
0 to 0.010
Niobium (Nb), % 0 to 0.1
0
Silver (Ag), % 0
1.8 to 2.2
Tin (Sn), % 5.5 to 6.5
90.8 to 92.7
Zinc (Zn), % 0 to 0.5
0 to 0.0010
Residuals, % 0 to 0.3
0