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C72900 Copper-nickel vs. Grade CY40 Nickel

C72900 copper-nickel belongs to the copper alloys classification, while grade CY40 nickel belongs to the nickel alloys. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C72900 copper-nickel and the bottom bar is grade CY40 nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
190
Elongation at Break, % 6.0 to 20
34
Poisson's Ratio 0.34
0.29
Shear Modulus, GPa 45
74
Tensile Strength: Ultimate (UTS), MPa 870 to 1080
540
Tensile Strength: Yield (Proof), MPa 700 to 920
220

Thermal Properties

Latent Heat of Fusion, J/g 210
330
Maximum Temperature: Mechanical, °C 210
960
Melting Completion (Liquidus), °C 1120
1350
Melting Onset (Solidus), °C 950
1300
Specific Heat Capacity, J/kg-K 380
470
Thermal Conductivity, W/m-K 29
14
Thermal Expansion, µm/m-K 17
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.8
1.7
Electrical Conductivity: Equal Weight (Specific), % IACS 8.0
1.8

Otherwise Unclassified Properties

Base Metal Price, % relative 39
55
Density, g/cm3 8.8
8.4
Embodied Carbon, kg CO2/kg material 4.6
9.1
Embodied Energy, MJ/kg 72
130
Embodied Water, L/kg 360
260

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 210
150
Resilience: Unit (Modulus of Resilience), kJ/m3 2030 to 3490
130
Stiffness to Weight: Axial, points 7.6
13
Stiffness to Weight: Bending, points 19
23
Strength to Weight: Axial, points 27 to 34
18
Strength to Weight: Bending, points 23 to 27
18
Thermal Diffusivity, mm2/s 8.6
3.7
Thermal Shock Resistance, points 31 to 38
16

Alloy Composition


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Carbon (C), % 0
0 to 0.4
Chromium (Cr), % 0
14 to 17
Copper (Cu), % 74.1 to 78
0
Iron (Fe), % 0 to 0.5
0 to 11
Lead (Pb), % 0 to 0.020
0
Magnesium (Mg), % 0 to 0.15
0
Manganese (Mn), % 0 to 0.3
0 to 1.5
Nickel (Ni), % 14.5 to 15.5
67 to 86
Niobium (Nb), % 0 to 0.1
0
Phosphorus (P), % 0
0 to 0.030
Silicon (Si), % 0
0 to 3.0
Sulfur (S), % 0
0 to 0.030
Tin (Sn), % 7.5 to 8.5
0
Zinc (Zn), % 0 to 0.5
0
Residuals, % 0 to 0.3
0