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C72900 Copper-nickel vs. Solder Alloy 503

C72900 copper-nickel belongs to the copper alloys classification, while solder alloy 503 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (7, in this case) are not shown.

For each property being compared, the top bar is C72900 copper-nickel and the bottom bar is solder alloy 503.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
54
Elongation at Break, % 6.0 to 20
30
Poisson's Ratio 0.34
0.36
Shear Modulus, GPa 45
20
Tensile Strength: Ultimate (UTS), MPa 870 to 1080
57

Thermal Properties

Latent Heat of Fusion, J/g 210
69
Melting Completion (Liquidus), °C 1120
380
Melting Onset (Solidus), °C 950
220
Specific Heat Capacity, J/kg-K 380
230
Thermal Conductivity, W/m-K 29
61
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.8
14
Electrical Conductivity: Equal Weight (Specific), % IACS 8.0
17

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.5
Embodied Carbon, kg CO2/kg material 4.6
16
Embodied Energy, MJ/kg 72
270

Common Calculations

Stiffness to Weight: Axial, points 7.6
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 27 to 34
2.1
Strength to Weight: Bending, points 23 to 27
4.4
Thermal Diffusivity, mm2/s 8.6
35
Thermal Shock Resistance, points 31 to 38
3.5

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.080
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 74.1 to 78
5.5 to 6.5
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.5
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Magnesium (Mg), % 0 to 0.15
0
Manganese (Mn), % 0 to 0.3
0
Nickel (Ni), % 14.5 to 15.5
0 to 0.010
Niobium (Nb), % 0 to 0.1
0
Silver (Ag), % 0
1.8 to 2.2
Tin (Sn), % 7.5 to 8.5
90.8 to 92.7
Zinc (Zn), % 0 to 0.5
0 to 0.0010
Residuals, % 0 to 0.3
0