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C72900 Copper-nickel vs. C96200 Copper-nickel

Both C72900 copper-nickel and C96200 copper-nickel are copper alloys. They have 87% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C72900 copper-nickel and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 6.0 to 20
23
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 45
46
Tensile Strength: Ultimate (UTS), MPa 870 to 1080
350
Tensile Strength: Yield (Proof), MPa 700 to 920
190

Thermal Properties

Latent Heat of Fusion, J/g 210
220
Maximum Temperature: Mechanical, °C 210
220
Melting Completion (Liquidus), °C 1120
1150
Melting Onset (Solidus), °C 950
1100
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 29
45
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.8
11
Electrical Conductivity: Equal Weight (Specific), % IACS 8.0
11

Otherwise Unclassified Properties

Base Metal Price, % relative 39
36
Density, g/cm3 8.8
8.9
Embodied Carbon, kg CO2/kg material 4.6
3.8
Embodied Energy, MJ/kg 72
58
Embodied Water, L/kg 360
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 210
68
Resilience: Unit (Modulus of Resilience), kJ/m3 2030 to 3490
150
Stiffness to Weight: Axial, points 7.6
7.8
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 27 to 34
11
Strength to Weight: Bending, points 23 to 27
13
Thermal Diffusivity, mm2/s 8.6
13
Thermal Shock Resistance, points 31 to 38
12

Alloy Composition


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Carbon (C), % 0
0 to 0.1
Copper (Cu), % 74.1 to 78
83.6 to 90
Iron (Fe), % 0 to 0.5
1.0 to 1.8
Lead (Pb), % 0 to 0.020
0 to 0.010
Magnesium (Mg), % 0 to 0.15
0
Manganese (Mn), % 0 to 0.3
0 to 1.5
Nickel (Ni), % 14.5 to 15.5
9.0 to 11
Niobium (Nb), % 0 to 0.1
0 to 1.0
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Tin (Sn), % 7.5 to 8.5
0
Zinc (Zn), % 0 to 0.5
0
Residuals, % 0 to 0.3
0 to 0.5