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C73100 Nickel Silver vs. C17300 Copper

Both C73100 nickel silver and C17300 copper are copper alloys. They have 75% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C73100 nickel silver and the bottom bar is C17300 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 3.4 to 8.0
3.0 to 23
Poisson's Ratio 0.32
0.33
Shear Modulus, GPa 43
45
Shear Strength, MPa 260 to 370
320 to 790
Tensile Strength: Ultimate (UTS), MPa 450 to 640
500 to 1380
Tensile Strength: Yield (Proof), MPa 420 to 590
160 to 1200

Thermal Properties

Latent Heat of Fusion, J/g 190
230
Maximum Temperature: Mechanical, °C 170
270
Melting Completion (Liquidus), °C 1030
980
Melting Onset (Solidus), °C 1000
870
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 35
110
Thermal Expansion, µm/m-K 19
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 7.5
22
Electrical Conductivity: Equal Weight (Specific), % IACS 8.0
23

Otherwise Unclassified Properties

Density, g/cm3 8.4
8.8
Embodied Carbon, kg CO2/kg material 3.0
9.4
Embodied Energy, MJ/kg 49
150
Embodied Water, L/kg 310
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 21 to 35
40 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 790 to 1560
110 to 5410
Stiffness to Weight: Axial, points 7.5
7.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 15 to 21
16 to 44
Strength to Weight: Bending, points 15 to 20
16 to 31
Thermal Diffusivity, mm2/s 11
32
Thermal Shock Resistance, points 15 to 21
17 to 48

Alloy Composition


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Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
1.8 to 2.0
Copper (Cu), % 70.8 to 78
95.5 to 97.8
Iron (Fe), % 0 to 0.1
0 to 0.4
Lead (Pb), % 0 to 0.050
0.2 to 0.6
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 4.0 to 6.0
0.2 to 0.6
Silicon (Si), % 0
0 to 0.2
Tin (Sn), % 0 to 0.1
0
Zinc (Zn), % 18 to 22
0
Residuals, % 0 to 0.5
0 to 0.5