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C75200 Nickel Silver vs. Solder Alloy 801

C75200 nickel silver belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 22 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C75200 nickel silver and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
53
Poisson's Ratio 0.32
0.35
Shear Modulus, GPa 47
20
Tensile Strength: Ultimate (UTS), MPa 400 to 660
55

Thermal Properties

Latent Heat of Fusion, J/g 210
64
Melting Completion (Liquidus), °C 1110
200
Melting Onset (Solidus), °C 1070
200
Specific Heat Capacity, J/kg-K 400
240
Thermal Conductivity, W/m-K 33
61
Thermal Expansion, µm/m-K 18
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
15
Electrical Conductivity: Equal Weight (Specific), % IACS 6.3
19

Otherwise Unclassified Properties

Density, g/cm3 8.5
7.2
Embodied Carbon, kg CO2/kg material 4.1
14
Embodied Energy, MJ/kg 62
240
Embodied Water, L/kg 300
1140

Common Calculations

Stiffness to Weight: Axial, points 8.0
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 13 to 21
2.1
Strength to Weight: Bending, points 14 to 20
4.4
Thermal Diffusivity, mm2/s 9.8
36
Thermal Shock Resistance, points 13 to 22
3.3

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 63.5 to 66.5
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.25
0 to 0.020
Lead (Pb), % 0 to 0.050
0 to 0.070
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 16.5 to 19.5
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 12.7 to 20
8.5 to 9.5
Residuals, % 0 to 0.5
0