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C75700 Nickel Silver vs. Solder Alloy 113

C75700 nickel silver belongs to the copper alloys classification, while solder alloy 113 belongs to the otherwise unclassified metals. There are 23 material properties with values for both materials. Properties with values for just one material (6, in this case) are not shown.

For each property being compared, the top bar is C75700 nickel silver and the bottom bar is solder alloy 113.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
32
Elongation at Break, % 3.2 to 22
32
Poisson's Ratio 0.32
0.4
Shear Modulus, GPa 45
11
Tensile Strength: Ultimate (UTS), MPa 590 to 610
39

Thermal Properties

Latent Heat of Fusion, J/g 200
40
Melting Completion (Liquidus), °C 1040
230
Melting Onset (Solidus), °C 990
180
Specific Heat Capacity, J/kg-K 390
170
Thermal Conductivity, W/m-K 40
46
Thermal Expansion, µm/m-K 16
26

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 8.0
10
Electrical Conductivity: Equal Weight (Specific), % IACS 8.6
9.8

Otherwise Unclassified Properties

Density, g/cm3 8.4
9.5
Embodied Carbon, kg CO2/kg material 3.6
8.9
Embodied Energy, MJ/kg 56
150
Embodied Water, L/kg 310
800

Common Calculations

Stiffness to Weight: Axial, points 7.8
1.8
Stiffness to Weight: Bending, points 19
11
Strength to Weight: Axial, points 19 to 20
1.1
Strength to Weight: Bending, points 19
2.7
Thermal Diffusivity, mm2/s 12
28
Thermal Shock Resistance, points 22 to 23
3.4

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.5
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.25
Cadmium (Cd), % 0
0 to 0.0050
Copper (Cu), % 63.5 to 66.5
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.25
0 to 0.020
Lead (Pb), % 0 to 0.050
53.4 to 55.5
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 11 to 13
0 to 0.010
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
44.5 to 45.5
Zinc (Zn), % 19.2 to 25.5
0 to 0.0010
Residuals, % 0 to 0.5
0