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C82200 Copper vs. C96300 Copper-nickel

Both C82200 copper and C96300 copper-nickel are copper alloys. They have 78% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C82200 copper and the bottom bar is C96300 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
130
Elongation at Break, % 8.0 to 20
11
Poisson's Ratio 0.34
0.33
Shear Modulus, GPa 44
49
Tensile Strength: Ultimate (UTS), MPa 390 to 660
580
Tensile Strength: Yield (Proof), MPa 210 to 520
430

Thermal Properties

Latent Heat of Fusion, J/g 220
230
Maximum Temperature: Mechanical, °C 230
240
Melting Completion (Liquidus), °C 1080
1200
Melting Onset (Solidus), °C 1040
1150
Specific Heat Capacity, J/kg-K 390
400
Thermal Conductivity, W/m-K 180
37
Thermal Expansion, µm/m-K 17
16

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 45
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 46
6.1

Otherwise Unclassified Properties

Base Metal Price, % relative 55
42
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 4.8
5.1
Embodied Energy, MJ/kg 74
76
Embodied Water, L/kg 310
290

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 49 to 66
59
Resilience: Unit (Modulus of Resilience), kJ/m3 180 to 1130
720
Stiffness to Weight: Axial, points 7.4
8.2
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 12 to 20
18
Strength to Weight: Bending, points 13 to 19
17
Thermal Diffusivity, mm2/s 53
10
Thermal Shock Resistance, points 14 to 23
20

Alloy Composition


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Beryllium (Be), % 0.35 to 0.8
0
Carbon (C), % 0
0 to 0.15
Cobalt (Co), % 0 to 0.3
0
Copper (Cu), % 97.4 to 98.7
72.3 to 80.8
Iron (Fe), % 0
0.5 to 1.5
Lead (Pb), % 0
0 to 0.010
Manganese (Mn), % 0
0.25 to 1.5
Nickel (Ni), % 1.0 to 2.0
18 to 22
Niobium (Nb), % 0
0.5 to 1.5
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Residuals, % 0 to 0.5
0 to 0.5