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C82500 Copper vs. ASTM Grade HH Steel

C82500 copper belongs to the copper alloys classification, while ASTM grade HH steel belongs to the iron alloys. There are 27 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C82500 copper and the bottom bar is ASTM grade HH steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 1.0 to 20
11
Poisson's Ratio 0.33
0.27
Shear Modulus, GPa 45
79
Tensile Strength: Ultimate (UTS), MPa 550 to 1100
580
Tensile Strength: Yield (Proof), MPa 310 to 980
270

Thermal Properties

Latent Heat of Fusion, J/g 240
310
Maximum Temperature: Mechanical, °C 280
1100
Melting Completion (Liquidus), °C 980
1400
Melting Onset (Solidus), °C 860
1360
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 130
14
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 20
2.1
Electrical Conductivity: Equal Weight (Specific), % IACS 21
2.4

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.7
Embodied Carbon, kg CO2/kg material 10
3.7
Embodied Energy, MJ/kg 160
53
Embodied Water, L/kg 310
180

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 94
53
Resilience: Unit (Modulus of Resilience), kJ/m3 400 to 4000
190
Stiffness to Weight: Axial, points 7.7
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 18 to 35
21
Strength to Weight: Bending, points 17 to 27
20
Thermal Diffusivity, mm2/s 38
3.8
Thermal Shock Resistance, points 19 to 38
12

Alloy Composition

Aluminum (Al), % 0 to 0.15
0
Beryllium (Be), % 1.9 to 2.3
0
Carbon (C), % 0
0.2 to 0.5
Chromium (Cr), % 0 to 0.1
24 to 28
Cobalt (Co), % 0.15 to 0.7
0
Copper (Cu), % 95.3 to 97.8
0
Iron (Fe), % 0 to 0.25
52.9 to 64.8
Lead (Pb), % 0 to 0.020
0
Manganese (Mn), % 0
0 to 2.0
Molybdenum (Mo), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.2
11 to 14
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0.2 to 0.35
0 to 2.0
Sulfur (S), % 0
0 to 0.040
Tin (Sn), % 0 to 0.1
0
Titanium (Ti), % 0 to 0.12
0
Zinc (Zn), % 0 to 0.1
0
Residuals, % 0 to 0.5
0