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C82500 Copper vs. ASTM Grade HK Steel

C82500 copper belongs to the copper alloys classification, while ASTM grade HK steel belongs to the iron alloys. There are 27 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is C82500 copper and the bottom bar is ASTM grade HK steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
200
Elongation at Break, % 1.0 to 20
11
Poisson's Ratio 0.33
0.27
Shear Modulus, GPa 45
79
Tensile Strength: Ultimate (UTS), MPa 550 to 1100
500
Tensile Strength: Yield (Proof), MPa 310 to 980
270

Thermal Properties

Latent Heat of Fusion, J/g 240
310
Maximum Temperature: Mechanical, °C 280
1100
Melting Completion (Liquidus), °C 980
1400
Melting Onset (Solidus), °C 860
1350
Specific Heat Capacity, J/kg-K 390
480
Thermal Conductivity, W/m-K 130
15
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 20
2.0
Electrical Conductivity: Equal Weight (Specific), % IACS 21
2.3

Otherwise Unclassified Properties

Density, g/cm3 8.8
7.8
Embodied Carbon, kg CO2/kg material 10
4.4
Embodied Energy, MJ/kg 160
63
Embodied Water, L/kg 310
200

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 11 to 94
48
Resilience: Unit (Modulus of Resilience), kJ/m3 400 to 4000
190
Stiffness to Weight: Axial, points 7.7
14
Stiffness to Weight: Bending, points 19
25
Strength to Weight: Axial, points 18 to 35
18
Strength to Weight: Bending, points 17 to 27
18
Thermal Diffusivity, mm2/s 38
3.9
Thermal Shock Resistance, points 19 to 38
11

Alloy Composition

Aluminum (Al), % 0 to 0.15
0
Beryllium (Be), % 1.9 to 2.3
0
Carbon (C), % 0
0.2 to 0.6
Chromium (Cr), % 0 to 0.1
24 to 28
Cobalt (Co), % 0.15 to 0.7
0
Copper (Cu), % 95.3 to 97.8
0
Iron (Fe), % 0 to 0.25
44.8 to 57.8
Lead (Pb), % 0 to 0.020
0
Manganese (Mn), % 0
0 to 2.0
Molybdenum (Mo), % 0
0 to 0.5
Nickel (Ni), % 0 to 0.2
18 to 22
Phosphorus (P), % 0
0 to 0.040
Silicon (Si), % 0.2 to 0.35
0 to 2.0
Sulfur (S), % 0
0 to 0.040
Tin (Sn), % 0 to 0.1
0
Titanium (Ti), % 0 to 0.12
0
Zinc (Zn), % 0 to 0.1
0
Residuals, % 0 to 0.5
0