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C82800 Copper vs. Solder Alloy 601

C82800 copper belongs to the copper alloys classification, while solder alloy 601 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C82800 copper and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
31
Elongation at Break, % 1.0 to 20
83
Poisson's Ratio 0.33
0.41
Shear Modulus, GPa 46
11
Tensile Strength: Ultimate (UTS), MPa 670 to 1140
12

Thermal Properties

Latent Heat of Fusion, J/g 240
43
Melting Completion (Liquidus), °C 930
120
Melting Onset (Solidus), °C 890
120
Specific Heat Capacity, J/kg-K 390
230
Thermal Conductivity, W/m-K 120
34
Thermal Expansion, µm/m-K 17
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 18
12
Electrical Conductivity: Equal Weight (Specific), % IACS 19
14

Otherwise Unclassified Properties

Density, g/cm3 8.7
7.3
Embodied Water, L/kg 310
1330

Common Calculations

Stiffness to Weight: Axial, points 7.8
2.3
Stiffness to Weight: Bending, points 19
14
Strength to Weight: Axial, points 21 to 36
0.45
Strength to Weight: Bending, points 20 to 28
1.6
Thermal Diffusivity, mm2/s 36
20
Thermal Shock Resistance, points 23 to 39
1.2

Alloy Composition


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Aluminum (Al), % 0 to 0.15
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Beryllium (Be), % 2.5 to 2.9
0
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Chromium (Cr), % 0 to 0.1
0
Cobalt (Co), % 0.15 to 0.7
0
Copper (Cu), % 94.6 to 97.2
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
51 to 52.5
Iron (Fe), % 0 to 0.25
0 to 0.020
Lead (Pb), % 0 to 0.020
0 to 0.070
Nickel (Ni), % 0 to 0.2
0 to 0.010
Silicon (Si), % 0.2 to 0.35
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.1
47.5 to 48.5
Titanium (Ti), % 0 to 0.12
0
Zinc (Zn), % 0 to 0.1
0 to 0.0010
Residuals, % 0 to 0.5
0