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C83400 Brass vs. C12900 Copper

Both C83400 brass and C12900 copper are copper alloys. They have a moderately high 90% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C83400 brass and the bottom bar is C12900 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 30
2.8 to 50
Poisson's Ratio 0.33
0.34
Rockwell F Hardness 50
40 to 95
Shear Modulus, GPa 42
43
Tensile Strength: Ultimate (UTS), MPa 240
220 to 420
Tensile Strength: Yield (Proof), MPa 69
75 to 380

Thermal Properties

Latent Heat of Fusion, J/g 200
210
Maximum Temperature: Mechanical, °C 180
200
Melting Completion (Liquidus), °C 1040
1080
Melting Onset (Solidus), °C 1020
1030
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 190
380
Thermal Expansion, µm/m-K 18
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 44
98
Electrical Conductivity: Equal Weight (Specific), % IACS 46
98

Otherwise Unclassified Properties

Base Metal Price, % relative 29
32
Density, g/cm3 8.7
9.0
Embodied Carbon, kg CO2/kg material 2.7
2.6
Embodied Energy, MJ/kg 43
41
Embodied Water, L/kg 320
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 55
11 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 21
24 to 640
Stiffness to Weight: Axial, points 7.2
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 7.7
6.8 to 13
Strength to Weight: Bending, points 9.9
9.1 to 14
Thermal Diffusivity, mm2/s 57
110
Thermal Shock Resistance, points 8.4
7.8 to 15

Alloy Composition


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Aluminum (Al), % 0 to 0.0050
0
Antimony (Sb), % 0 to 0.25
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Bismuth (Bi), % 0
0 to 0.0030
Copper (Cu), % 88 to 92
99.88 to 100
Iron (Fe), % 0 to 0.25
0
Lead (Pb), % 0 to 0.5
0 to 0.0040
Nickel (Ni), % 0 to 1.0
0 to 0.050
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 0 to 0.0050
0
Silver (Ag), % 0
0 to 0.054
Sulfur (S), % 0 to 0.080
0
Tellurium (Te), % 0
0 to 0.025
Tin (Sn), % 0 to 0.2
0
Zinc (Zn), % 8.0 to 12
0
Residuals, % 0 to 0.7
0