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C85400 Brass vs. C96200 Copper-nickel

Both C85400 brass and C96200 copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 69% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C85400 brass and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 100
120
Elongation at Break, % 23
23
Poisson's Ratio 0.32
0.34
Shear Modulus, GPa 40
46
Tensile Strength: Ultimate (UTS), MPa 220
350
Tensile Strength: Yield (Proof), MPa 85
190

Thermal Properties

Latent Heat of Fusion, J/g 180
220
Maximum Temperature: Mechanical, °C 130
220
Melting Completion (Liquidus), °C 940
1150
Melting Onset (Solidus), °C 940
1100
Specific Heat Capacity, J/kg-K 380
390
Thermal Conductivity, W/m-K 89
45
Thermal Expansion, µm/m-K 20
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 20
11
Electrical Conductivity: Equal Weight (Specific), % IACS 22
11

Otherwise Unclassified Properties

Base Metal Price, % relative 25
36
Density, g/cm3 8.3
8.9
Embodied Carbon, kg CO2/kg material 2.8
3.8
Embodied Energy, MJ/kg 46
58
Embodied Water, L/kg 330
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 40
68
Resilience: Unit (Modulus of Resilience), kJ/m3 35
150
Stiffness to Weight: Axial, points 7.0
7.8
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 7.5
11
Strength to Weight: Bending, points 9.9
13
Thermal Diffusivity, mm2/s 28
13
Thermal Shock Resistance, points 7.6
12

Alloy Composition


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Aluminum (Al), % 0 to 0.35
0
Carbon (C), % 0
0 to 0.1
Copper (Cu), % 65 to 70
83.6 to 90
Iron (Fe), % 0 to 0.7
1.0 to 1.8
Lead (Pb), % 1.5 to 3.8
0 to 0.010
Manganese (Mn), % 0
0 to 1.5
Nickel (Ni), % 0 to 1.0
9.0 to 11
Niobium (Nb), % 0
0 to 1.0
Phosphorus (P), % 0
0 to 0.020
Silicon (Si), % 0 to 0.050
0 to 0.5
Sulfur (S), % 0
0 to 0.020
Tin (Sn), % 0.5 to 1.5
0
Zinc (Zn), % 24 to 32
0
Residuals, % 0 to 1.1
0 to 0.5