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C96200 Copper-nickel vs. CR003A Copper

Both C96200 copper-nickel and CR003A copper are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 87% of their average alloy composition in common.

For each property being compared, the top bar is C96200 copper-nickel and the bottom bar is CR003A copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 23
15
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 46
43
Tensile Strength: Ultimate (UTS), MPa 350
230
Tensile Strength: Yield (Proof), MPa 190
140

Thermal Properties

Latent Heat of Fusion, J/g 220
210
Maximum Temperature: Mechanical, °C 220
200
Melting Completion (Liquidus), °C 1150
1090
Melting Onset (Solidus), °C 1100
1040
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 45
380
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
100
Electrical Conductivity: Equal Weight (Specific), % IACS 11
100

Otherwise Unclassified Properties

Base Metal Price, % relative 36
31
Density, g/cm3 8.9
9.0
Embodied Carbon, kg CO2/kg material 3.8
2.6
Embodied Energy, MJ/kg 58
41
Embodied Water, L/kg 300
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 68
31
Resilience: Unit (Modulus of Resilience), kJ/m3 150
83
Stiffness to Weight: Axial, points 7.8
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 11
7.1
Strength to Weight: Bending, points 13
9.3
Thermal Diffusivity, mm2/s 13
110
Thermal Shock Resistance, points 12
8.1

Alloy Composition


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Antimony (Sb), % 0
0 to 0.00040
Arsenic (As), % 0
0 to 0.00050
Bismuth (Bi), % 0
0 to 0.00020
Carbon (C), % 0 to 0.1
0
Copper (Cu), % 83.6 to 90
99.954 to 100
Iron (Fe), % 1.0 to 1.8
0 to 0.0010
Lead (Pb), % 0 to 0.010
0 to 0.00050
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 9.0 to 11
0
Niobium (Nb), % 0 to 1.0
0
Oxygen (O), % 0
0 to 0.040
Phosphorus (P), % 0 to 0.020
0
Selenium (Se), % 0
0 to 0.00020
Silicon (Si), % 0 to 0.5
0
Silver (Ag), % 0
0 to 0.0025
Sulfur (S), % 0 to 0.020
0 to 0.0015
Tellurium (Te), % 0
0 to 0.00020
Residuals, % 0 to 0.5
0