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C96300 Copper-nickel vs. ASTM A229 Spring Steel

C96300 copper-nickel belongs to the copper alloys classification, while ASTM A229 spring steel belongs to the iron alloys. There are 29 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is ASTM A229 spring steel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 150
490 to 550
Elastic (Young's, Tensile) Modulus, GPa 130
190
Elongation at Break, % 11
14
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 49
72
Tensile Strength: Ultimate (UTS), MPa 580
1690 to 1890
Tensile Strength: Yield (Proof), MPa 430
1100 to 1230

Thermal Properties

Latent Heat of Fusion, J/g 230
250
Maximum Temperature: Mechanical, °C 240
400
Melting Completion (Liquidus), °C 1200
1450
Melting Onset (Solidus), °C 1150
1410
Specific Heat Capacity, J/kg-K 400
470
Thermal Conductivity, W/m-K 37
50
Thermal Expansion, µm/m-K 16
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
7.2
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
8.3

Otherwise Unclassified Properties

Base Metal Price, % relative 42
1.8
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 5.1
1.4
Embodied Energy, MJ/kg 76
19
Embodied Water, L/kg 290
46

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
200 to 230
Resilience: Unit (Modulus of Resilience), kJ/m3 720
3260 to 4080
Stiffness to Weight: Axial, points 8.2
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 18
60 to 67
Strength to Weight: Bending, points 17
40 to 43
Thermal Diffusivity, mm2/s 10
14
Thermal Shock Resistance, points 20
54 to 60

Alloy Composition


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Carbon (C), % 0 to 0.15
0.55 to 0.85
Copper (Cu), % 72.3 to 80.8
0
Iron (Fe), % 0.5 to 1.5
97.5 to 99
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0.25 to 1.5
0.3 to 1.2
Nickel (Ni), % 18 to 22
0
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0 to 0.040
Silicon (Si), % 0 to 0.5
0.15 to 0.35
Sulfur (S), % 0 to 0.020
0 to 0.050
Residuals, % 0 to 0.5
0