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C96300 Copper-nickel vs. CC383H Copper-nickel

Both C96300 copper-nickel and CC383H copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 89% of their average alloy composition in common.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 150
130
Elastic (Young's, Tensile) Modulus, GPa 130
140
Elongation at Break, % 11
20
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 49
52
Tensile Strength: Ultimate (UTS), MPa 580
490
Tensile Strength: Yield (Proof), MPa 430
260

Thermal Properties

Latent Heat of Fusion, J/g 230
240
Maximum Temperature: Mechanical, °C 240
260
Melting Completion (Liquidus), °C 1200
1180
Melting Onset (Solidus), °C 1150
1130
Specific Heat Capacity, J/kg-K 400
410
Thermal Conductivity, W/m-K 37
29
Thermal Expansion, µm/m-K 16
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 42
44
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.1
5.7
Embodied Energy, MJ/kg 76
83
Embodied Water, L/kg 290
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
84
Resilience: Unit (Modulus of Resilience), kJ/m3 720
250
Stiffness to Weight: Axial, points 8.2
8.6
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 18
15
Strength to Weight: Bending, points 17
16
Thermal Diffusivity, mm2/s 10
8.1
Thermal Shock Resistance, points 20
17

Alloy Composition


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Aluminum (Al), % 0
0 to 0.010
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0 to 0.15
0 to 0.030
Copper (Cu), % 72.3 to 80.8
64 to 69.1
Iron (Fe), % 0.5 to 1.5
0.5 to 1.5
Lead (Pb), % 0 to 0.010
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0.25 to 1.5
0.6 to 1.2
Nickel (Ni), % 18 to 22
29 to 31
Niobium (Nb), % 0.5 to 1.5
0.5 to 1.0
Phosphorus (P), % 0 to 0.020
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0 to 0.5
0.3 to 0.7
Sulfur (S), % 0 to 0.020
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Zinc (Zn), % 0
0 to 0.5
Residuals, % 0 to 0.5
0