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C96300 Copper-nickel vs. CR019A Copper

Both C96300 copper-nickel and CR019A copper are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 77% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is CR019A copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
120
Elongation at Break, % 11
15
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 49
43
Tensile Strength: Ultimate (UTS), MPa 580
220
Tensile Strength: Yield (Proof), MPa 430
130

Thermal Properties

Latent Heat of Fusion, J/g 230
210
Maximum Temperature: Mechanical, °C 240
200
Melting Completion (Liquidus), °C 1200
1090
Melting Onset (Solidus), °C 1150
1040
Specific Heat Capacity, J/kg-K 400
390
Thermal Conductivity, W/m-K 37
390
Thermal Expansion, µm/m-K 16
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
100
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
100

Otherwise Unclassified Properties

Base Metal Price, % relative 42
35
Density, g/cm3 8.9
9.0
Embodied Carbon, kg CO2/kg material 5.1
2.7
Embodied Energy, MJ/kg 76
42
Embodied Water, L/kg 290
390

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
29
Resilience: Unit (Modulus of Resilience), kJ/m3 720
76
Stiffness to Weight: Axial, points 8.2
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 18
6.8
Strength to Weight: Bending, points 17
9.0
Thermal Diffusivity, mm2/s 10
110
Thermal Shock Resistance, points 20
7.8

Alloy Composition


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Bismuth (Bi), % 0
0 to 0.00050
Carbon (C), % 0 to 0.15
0
Copper (Cu), % 72.3 to 80.8
99.874 to 99.92
Iron (Fe), % 0.5 to 1.5
0
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0.25 to 1.5
0
Nickel (Ni), % 18 to 22
0
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 0 to 0.5
0
Silver (Ag), % 0
0.080 to 0.12
Sulfur (S), % 0 to 0.020
0
Residuals, % 0 to 0.5
0