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C96300 Copper-nickel vs. Grade M30H Nickel

C96300 copper-nickel belongs to the copper alloys classification, while grade M30H nickel belongs to the nickel alloys. They have 52% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is grade M30H nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
160
Elongation at Break, % 11
11
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 49
61
Tensile Strength: Ultimate (UTS), MPa 580
770
Tensile Strength: Yield (Proof), MPa 430
470

Thermal Properties

Latent Heat of Fusion, J/g 230
320
Maximum Temperature: Mechanical, °C 240
900
Melting Completion (Liquidus), °C 1200
1250
Melting Onset (Solidus), °C 1150
1200
Specific Heat Capacity, J/kg-K 400
440
Thermal Conductivity, W/m-K 37
22
Thermal Expansion, µm/m-K 16
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
3.4

Otherwise Unclassified Properties

Base Metal Price, % relative 42
50
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 5.1
7.7
Embodied Energy, MJ/kg 76
110
Embodied Water, L/kg 290
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
75
Resilience: Unit (Modulus of Resilience), kJ/m3 720
700
Stiffness to Weight: Axial, points 8.2
10
Stiffness to Weight: Bending, points 19
21
Strength to Weight: Axial, points 18
25
Strength to Weight: Bending, points 17
22
Thermal Diffusivity, mm2/s 10
5.7
Thermal Shock Resistance, points 20
27

Alloy Composition


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Carbon (C), % 0 to 0.15
0 to 0.3
Copper (Cu), % 72.3 to 80.8
27 to 33
Iron (Fe), % 0.5 to 1.5
0 to 3.5
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0.25 to 1.5
0 to 1.5
Nickel (Ni), % 18 to 22
57.9 to 70.3
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0 to 0.030
Silicon (Si), % 0 to 0.5
2.7 to 3.7
Sulfur (S), % 0 to 0.020
0 to 0.030
Residuals, % 0 to 0.5
0