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C96300 Copper-nickel vs. C12500 Copper

Both C96300 copper-nickel and C12500 copper are copper alloys. They have 77% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is C12500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
120
Elongation at Break, % 11
1.5 to 50
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 49
43
Tensile Strength: Ultimate (UTS), MPa 580
220 to 420
Tensile Strength: Yield (Proof), MPa 430
75 to 390

Thermal Properties

Latent Heat of Fusion, J/g 230
210
Maximum Temperature: Mechanical, °C 240
200
Melting Completion (Liquidus), °C 1200
1080
Melting Onset (Solidus), °C 1150
1070
Specific Heat Capacity, J/kg-K 400
390
Thermal Conductivity, W/m-K 37
350
Thermal Expansion, µm/m-K 16
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
92
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
93

Otherwise Unclassified Properties

Base Metal Price, % relative 42
31
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.1
2.6
Embodied Energy, MJ/kg 76
41
Embodied Water, L/kg 290
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
5.6 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 720
24 to 660
Stiffness to Weight: Axial, points 8.2
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 18
6.9 to 13
Strength to Weight: Bending, points 17
9.1 to 14
Thermal Diffusivity, mm2/s 10
100
Thermal Shock Resistance, points 20
7.8 to 15

Alloy Composition


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Antimony (Sb), % 0
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Bismuth (Bi), % 0
0 to 0.0030
Carbon (C), % 0 to 0.15
0
Copper (Cu), % 72.3 to 80.8
99.88 to 100
Iron (Fe), % 0.5 to 1.5
0
Lead (Pb), % 0 to 0.010
0 to 0.0040
Manganese (Mn), % 0.25 to 1.5
0
Nickel (Ni), % 18 to 22
0 to 0.050
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 0 to 0.5
0
Sulfur (S), % 0 to 0.020
0
Tellurium (Te), % 0
0 to 0.025
Residuals, % 0 to 0.5
0 to 0.3