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C96300 Copper-nickel vs. C17500 Copper

Both C96300 copper-nickel and C17500 copper are copper alloys. They have 77% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is C17500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
120
Elongation at Break, % 11
6.0 to 30
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 49
45
Tensile Strength: Ultimate (UTS), MPa 580
310 to 860
Tensile Strength: Yield (Proof), MPa 430
170 to 760

Thermal Properties

Latent Heat of Fusion, J/g 230
220
Maximum Temperature: Mechanical, °C 240
220
Melting Completion (Liquidus), °C 1200
1060
Melting Onset (Solidus), °C 1150
1020
Specific Heat Capacity, J/kg-K 400
390
Thermal Conductivity, W/m-K 37
200
Thermal Expansion, µm/m-K 16
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
24 to 53
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
24 to 54

Otherwise Unclassified Properties

Base Metal Price, % relative 42
60
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.1
4.7
Embodied Energy, MJ/kg 76
73
Embodied Water, L/kg 290
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
30 to 120
Resilience: Unit (Modulus of Resilience), kJ/m3 720
120 to 2390
Stiffness to Weight: Axial, points 8.2
7.5
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 18
9.7 to 27
Strength to Weight: Bending, points 17
11 to 23
Thermal Diffusivity, mm2/s 10
59
Thermal Shock Resistance, points 20
11 to 29

Alloy Composition


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Aluminum (Al), % 0
0 to 0.2
Beryllium (Be), % 0
0.4 to 0.7
Carbon (C), % 0 to 0.15
0
Cobalt (Co), % 0
2.4 to 2.7
Copper (Cu), % 72.3 to 80.8
95.6 to 97.2
Iron (Fe), % 0.5 to 1.5
0 to 0.1
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0.25 to 1.5
0
Nickel (Ni), % 18 to 22
0
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 0 to 0.5
0 to 0.2
Sulfur (S), % 0 to 0.020
0
Residuals, % 0 to 0.5
0 to 0.5