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C96300 Copper-nickel vs. C85500 Brass

Both C96300 copper-nickel and C85500 brass are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 62% of their average alloy composition in common. There are 29 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is C85500 brass.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 150
85
Elastic (Young's, Tensile) Modulus, GPa 130
100
Elongation at Break, % 11
40
Poisson's Ratio 0.33
0.31
Shear Modulus, GPa 49
40
Tensile Strength: Ultimate (UTS), MPa 580
410
Tensile Strength: Yield (Proof), MPa 430
160

Thermal Properties

Latent Heat of Fusion, J/g 230
170
Maximum Temperature: Mechanical, °C 240
120
Melting Completion (Liquidus), °C 1200
900
Melting Onset (Solidus), °C 1150
890
Specific Heat Capacity, J/kg-K 400
390
Thermal Conductivity, W/m-K 37
120
Thermal Expansion, µm/m-K 16
21

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
26
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
29

Otherwise Unclassified Properties

Base Metal Price, % relative 42
23
Density, g/cm3 8.9
8.0
Embodied Carbon, kg CO2/kg material 5.1
2.7
Embodied Energy, MJ/kg 76
46
Embodied Water, L/kg 290
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
130
Resilience: Unit (Modulus of Resilience), kJ/m3 720
120
Stiffness to Weight: Axial, points 8.2
7.3
Stiffness to Weight: Bending, points 19
20
Strength to Weight: Axial, points 18
14
Strength to Weight: Bending, points 17
15
Thermal Diffusivity, mm2/s 10
38
Thermal Shock Resistance, points 20
14

Alloy Composition


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Carbon (C), % 0 to 0.15
0
Copper (Cu), % 72.3 to 80.8
59 to 63
Iron (Fe), % 0.5 to 1.5
0 to 0.2
Lead (Pb), % 0 to 0.010
0 to 0.2
Manganese (Mn), % 0.25 to 1.5
0 to 0.2
Nickel (Ni), % 18 to 22
0 to 0.2
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 0 to 0.5
0
Sulfur (S), % 0 to 0.020
0
Tin (Sn), % 0
0 to 0.2
Zinc (Zn), % 0
35.1 to 41
Residuals, % 0 to 0.5
0 to 0.9