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C96300 Copper-nickel vs. C96200 Copper-nickel

Both C96300 copper-nickel and C96200 copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 89% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C96300 copper-nickel and the bottom bar is C96200 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 130
120
Elongation at Break, % 11
23
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 49
46
Tensile Strength: Ultimate (UTS), MPa 580
350
Tensile Strength: Yield (Proof), MPa 430
190

Thermal Properties

Latent Heat of Fusion, J/g 230
220
Maximum Temperature: Mechanical, °C 240
220
Melting Completion (Liquidus), °C 1200
1150
Melting Onset (Solidus), °C 1150
1100
Specific Heat Capacity, J/kg-K 400
390
Thermal Conductivity, W/m-K 37
45
Thermal Expansion, µm/m-K 16
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
11
Electrical Conductivity: Equal Weight (Specific), % IACS 6.1
11

Otherwise Unclassified Properties

Base Metal Price, % relative 42
36
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.1
3.8
Embodied Energy, MJ/kg 76
58
Embodied Water, L/kg 290
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 59
68
Resilience: Unit (Modulus of Resilience), kJ/m3 720
150
Stiffness to Weight: Axial, points 8.2
7.8
Stiffness to Weight: Bending, points 19
19
Strength to Weight: Axial, points 18
11
Strength to Weight: Bending, points 17
13
Thermal Diffusivity, mm2/s 10
13
Thermal Shock Resistance, points 20
12

Alloy Composition

Carbon (C), % 0 to 0.15
0 to 0.1
Copper (Cu), % 72.3 to 80.8
83.6 to 90
Iron (Fe), % 0.5 to 1.5
1.0 to 1.8
Lead (Pb), % 0 to 0.010
0 to 0.010
Manganese (Mn), % 0.25 to 1.5
0 to 1.5
Nickel (Ni), % 18 to 22
9.0 to 11
Niobium (Nb), % 0.5 to 1.5
0 to 1.0
Phosphorus (P), % 0 to 0.020
0 to 0.020
Silicon (Si), % 0 to 0.5
0 to 0.5
Sulfur (S), % 0 to 0.020
0 to 0.020
Residuals, % 0 to 0.5
0 to 0.5