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C96400 Copper-nickel vs. EN 1.1170 Steel

C96400 copper-nickel belongs to the copper alloys classification, while EN 1.1170 steel belongs to the iron alloys. There are 28 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is C96400 copper-nickel and the bottom bar is EN 1.1170 steel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
190
Elongation at Break, % 25
16 to 17
Poisson's Ratio 0.33
0.29
Shear Modulus, GPa 51
73
Tensile Strength: Ultimate (UTS), MPa 490
640 to 730
Tensile Strength: Yield (Proof), MPa 260
330 to 500

Thermal Properties

Latent Heat of Fusion, J/g 240
250
Maximum Temperature: Mechanical, °C 260
400
Melting Completion (Liquidus), °C 1240
1460
Melting Onset (Solidus), °C 1170
1420
Specific Heat Capacity, J/kg-K 400
470
Thermal Conductivity, W/m-K 28
50
Thermal Expansion, µm/m-K 15
12

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.0
7.3
Electrical Conductivity: Equal Weight (Specific), % IACS 5.1
8.4

Otherwise Unclassified Properties

Base Metal Price, % relative 45
2.1
Density, g/cm3 8.9
7.8
Embodied Carbon, kg CO2/kg material 5.9
1.5
Embodied Energy, MJ/kg 87
19
Embodied Water, L/kg 280
49

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
91 to 100
Resilience: Unit (Modulus of Resilience), kJ/m3 250
290 to 670
Stiffness to Weight: Axial, points 8.6
13
Stiffness to Weight: Bending, points 19
24
Strength to Weight: Axial, points 15
23 to 26
Strength to Weight: Bending, points 16
21 to 23
Thermal Diffusivity, mm2/s 7.8
13
Thermal Shock Resistance, points 17
20 to 23

Alloy Composition


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Carbon (C), % 0 to 0.15
0.25 to 0.32
Chromium (Cr), % 0
0 to 0.4
Copper (Cu), % 62.3 to 71.3
0
Iron (Fe), % 0.25 to 1.5
96.7 to 98.5
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0 to 1.5
1.3 to 1.7
Molybdenum (Mo), % 0
0 to 0.1
Nickel (Ni), % 28 to 32
0 to 0.4
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0 to 0.035
Silicon (Si), % 0 to 0.5
0 to 0.4
Sulfur (S), % 0 to 0.020
0 to 0.035
Residuals, % 0 to 0.5
0