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C96400 Copper-nickel vs. Grade M30H Nickel

C96400 copper-nickel belongs to the copper alloys classification, while grade M30H nickel belongs to the nickel alloys. They have 62% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C96400 copper-nickel and the bottom bar is grade M30H nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
160
Elongation at Break, % 25
11
Poisson's Ratio 0.33
0.32
Shear Modulus, GPa 51
61
Tensile Strength: Ultimate (UTS), MPa 490
770
Tensile Strength: Yield (Proof), MPa 260
470

Thermal Properties

Latent Heat of Fusion, J/g 240
320
Maximum Temperature: Mechanical, °C 260
900
Melting Completion (Liquidus), °C 1240
1250
Melting Onset (Solidus), °C 1170
1200
Specific Heat Capacity, J/kg-K 400
440
Thermal Conductivity, W/m-K 28
22
Thermal Expansion, µm/m-K 15
13

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.0
3.3
Electrical Conductivity: Equal Weight (Specific), % IACS 5.1
3.4

Otherwise Unclassified Properties

Base Metal Price, % relative 45
50
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 5.9
7.7
Embodied Energy, MJ/kg 87
110
Embodied Water, L/kg 280
250

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
75
Resilience: Unit (Modulus of Resilience), kJ/m3 250
700
Stiffness to Weight: Axial, points 8.6
10
Stiffness to Weight: Bending, points 19
21
Strength to Weight: Axial, points 15
25
Strength to Weight: Bending, points 16
22
Thermal Diffusivity, mm2/s 7.8
5.7
Thermal Shock Resistance, points 17
27

Alloy Composition


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Carbon (C), % 0 to 0.15
0 to 0.3
Copper (Cu), % 62.3 to 71.3
27 to 33
Iron (Fe), % 0.25 to 1.5
0 to 3.5
Lead (Pb), % 0 to 0.010
0
Manganese (Mn), % 0 to 1.5
0 to 1.5
Nickel (Ni), % 28 to 32
57.9 to 70.3
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0 to 0.030
Silicon (Si), % 0 to 0.5
2.7 to 3.7
Sulfur (S), % 0 to 0.020
0 to 0.030
Residuals, % 0 to 0.5
0