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C96400 Copper-nickel vs. Solder Alloy 601

C96400 copper-nickel belongs to the copper alloys classification, while solder alloy 601 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C96400 copper-nickel and the bottom bar is solder alloy 601.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
31
Elongation at Break, % 25
83
Poisson's Ratio 0.33
0.41
Shear Modulus, GPa 51
11
Tensile Strength: Ultimate (UTS), MPa 490
12

Thermal Properties

Latent Heat of Fusion, J/g 240
43
Melting Completion (Liquidus), °C 1240
120
Melting Onset (Solidus), °C 1170
120
Specific Heat Capacity, J/kg-K 400
230
Thermal Conductivity, W/m-K 28
34
Thermal Expansion, µm/m-K 15
23

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.0
12
Electrical Conductivity: Equal Weight (Specific), % IACS 5.1
14

Otherwise Unclassified Properties

Density, g/cm3 8.9
7.3
Embodied Water, L/kg 280
1330

Common Calculations

Stiffness to Weight: Axial, points 8.6
2.3
Stiffness to Weight: Bending, points 19
14
Strength to Weight: Axial, points 15
0.45
Strength to Weight: Bending, points 16
1.6
Thermal Diffusivity, mm2/s 7.8
20
Thermal Shock Resistance, points 17
1.2

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Carbon (C), % 0 to 0.15
0
Copper (Cu), % 62.3 to 71.3
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
51 to 52.5
Iron (Fe), % 0.25 to 1.5
0 to 0.020
Lead (Pb), % 0 to 0.010
0 to 0.070
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 28 to 32
0 to 0.010
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 0 to 0.5
0
Silver (Ag), % 0
0 to 0.1
Sulfur (S), % 0 to 0.020
0
Tin (Sn), % 0
47.5 to 48.5
Zinc (Zn), % 0
0 to 0.0010
Residuals, % 0 to 0.5
0