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C96400 Copper-nickel vs. C12900 Copper

Both C96400 copper-nickel and C12900 copper are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C96400 copper-nickel and the bottom bar is C12900 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
120
Elongation at Break, % 25
2.8 to 50
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 51
43
Tensile Strength: Ultimate (UTS), MPa 490
220 to 420
Tensile Strength: Yield (Proof), MPa 260
75 to 380

Thermal Properties

Latent Heat of Fusion, J/g 240
210
Maximum Temperature: Mechanical, °C 260
200
Melting Completion (Liquidus), °C 1240
1080
Melting Onset (Solidus), °C 1170
1030
Specific Heat Capacity, J/kg-K 400
390
Thermal Conductivity, W/m-K 28
380
Thermal Expansion, µm/m-K 15
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.0
98
Electrical Conductivity: Equal Weight (Specific), % IACS 5.1
98

Otherwise Unclassified Properties

Base Metal Price, % relative 45
32
Density, g/cm3 8.9
9.0
Embodied Carbon, kg CO2/kg material 5.9
2.6
Embodied Energy, MJ/kg 87
41
Embodied Water, L/kg 280
330

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
11 to 88
Resilience: Unit (Modulus of Resilience), kJ/m3 250
24 to 640
Stiffness to Weight: Axial, points 8.6
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 15
6.8 to 13
Strength to Weight: Bending, points 16
9.1 to 14
Thermal Diffusivity, mm2/s 7.8
110
Thermal Shock Resistance, points 17
7.8 to 15

Alloy Composition


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Antimony (Sb), % 0
0 to 0.0030
Arsenic (As), % 0
0 to 0.012
Bismuth (Bi), % 0
0 to 0.0030
Carbon (C), % 0 to 0.15
0
Copper (Cu), % 62.3 to 71.3
99.88 to 100
Iron (Fe), % 0.25 to 1.5
0
Lead (Pb), % 0 to 0.010
0 to 0.0040
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 28 to 32
0 to 0.050
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0
Silicon (Si), % 0 to 0.5
0
Silver (Ag), % 0
0 to 0.054
Sulfur (S), % 0 to 0.020
0
Tellurium (Te), % 0
0 to 0.025
Residuals, % 0 to 0.5
0