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C96400 Copper-nickel vs. C15500 Copper

Both C96400 copper-nickel and C15500 copper are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (2, in this case) are not shown.

For each property being compared, the top bar is C96400 copper-nickel and the bottom bar is C15500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 140
120
Elongation at Break, % 25
3.0 to 37
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 51
43
Tensile Strength: Ultimate (UTS), MPa 490
280 to 550
Tensile Strength: Yield (Proof), MPa 260
130 to 530

Thermal Properties

Latent Heat of Fusion, J/g 240
210
Maximum Temperature: Mechanical, °C 260
200
Melting Completion (Liquidus), °C 1240
1080
Melting Onset (Solidus), °C 1170
1080
Specific Heat Capacity, J/kg-K 400
390
Thermal Conductivity, W/m-K 28
350
Thermal Expansion, µm/m-K 15
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.0
90
Electrical Conductivity: Equal Weight (Specific), % IACS 5.1
91

Otherwise Unclassified Properties

Base Metal Price, % relative 45
33
Density, g/cm3 8.9
8.9
Embodied Carbon, kg CO2/kg material 5.9
2.7
Embodied Energy, MJ/kg 87
42
Embodied Water, L/kg 280
360

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 100
15 to 84
Resilience: Unit (Modulus of Resilience), kJ/m3 250
72 to 1210
Stiffness to Weight: Axial, points 8.6
7.2
Stiffness to Weight: Bending, points 19
18
Strength to Weight: Axial, points 15
8.6 to 17
Strength to Weight: Bending, points 16
11 to 17
Thermal Diffusivity, mm2/s 7.8
100
Thermal Shock Resistance, points 17
9.8 to 20

Alloy Composition


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Carbon (C), % 0 to 0.15
0
Copper (Cu), % 62.3 to 71.3
99.75 to 99.853
Iron (Fe), % 0.25 to 1.5
0
Lead (Pb), % 0 to 0.010
0
Magnesium (Mg), % 0
0.080 to 0.13
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 28 to 32
0
Niobium (Nb), % 0.5 to 1.5
0
Phosphorus (P), % 0 to 0.020
0.040 to 0.080
Silicon (Si), % 0 to 0.5
0
Silver (Ag), % 0
0.027 to 0.1
Sulfur (S), % 0 to 0.020
0
Residuals, % 0 to 0.5
0 to 0.2