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C96900 Copper-nickel vs. Solder Alloy 171

C96900 copper-nickel belongs to the copper alloys classification, while solder alloy 171 belongs to the otherwise unclassified metals. There are 20 material properties with values for both materials. Properties with values for just one material (9, in this case) are not shown.

For each property being compared, the top bar is C96900 copper-nickel and the bottom bar is solder alloy 171.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
38
Elongation at Break, % 4.5
45
Poisson's Ratio 0.34
0.39
Shear Modulus, GPa 45
14
Tensile Strength: Ultimate (UTS), MPa 850
48

Thermal Properties

Latent Heat of Fusion, J/g 210
47
Melting Completion (Liquidus), °C 1060
180
Melting Onset (Solidus), °C 960
180
Specific Heat Capacity, J/kg-K 380
190
Thermal Expansion, µm/m-K 17
24

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 9.0
12
Electrical Conductivity: Equal Weight (Specific), % IACS 9.2
12

Otherwise Unclassified Properties

Density, g/cm3 8.8
8.8
Embodied Carbon, kg CO2/kg material 4.6
13
Embodied Energy, MJ/kg 72
210

Common Calculations

Stiffness to Weight: Axial, points 7.7
2.4
Stiffness to Weight: Bending, points 19
13
Strength to Weight: Axial, points 27
1.5
Strength to Weight: Bending, points 23
3.3
Thermal Shock Resistance, points 30
3.7

Alloy Composition


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Aluminum (Al), % 0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.2
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 73.6 to 78
0 to 0.080
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.5
0 to 0.020
Lead (Pb), % 0 to 0.020
34.7 to 36.7
Magnesium (Mg), % 0 to 0.15
0
Manganese (Mn), % 0.050 to 0.3
0
Nickel (Ni), % 14.5 to 15.5
0 to 0.010
Niobium (Nb), % 0 to 0.1
0
Silicon (Si), % 0 to 0.3
0
Silver (Ag), % 0
1.8 to 2.2
Tin (Sn), % 7.5 to 8.5
61.5 to 62.5
Zinc (Zn), % 0 to 0.5
0 to 0.0010
Residuals, % 0 to 0.5
0