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C97300 Nickel Silver vs. CC383H Copper-nickel

Both C97300 nickel silver and CC383H copper-nickel are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 69% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C97300 nickel silver and the bottom bar is CC383H copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
140
Elongation at Break, % 9.0
20
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 40
52
Tensile Strength: Ultimate (UTS), MPa 230
490
Tensile Strength: Yield (Proof), MPa 110
260

Thermal Properties

Latent Heat of Fusion, J/g 180
240
Maximum Temperature: Mechanical, °C 150
260
Melting Completion (Liquidus), °C 1040
1180
Melting Onset (Solidus), °C 1010
1130
Specific Heat Capacity, J/kg-K 370
410
Thermal Conductivity, W/m-K 29
29
Thermal Expansion, µm/m-K 19
15

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
5.2
Electrical Conductivity: Equal Weight (Specific), % IACS 6.3
5.3

Otherwise Unclassified Properties

Base Metal Price, % relative 30
44
Density, g/cm3 8.6
8.9
Embodied Carbon, kg CO2/kg material 3.7
5.7
Embodied Energy, MJ/kg 59
83
Embodied Water, L/kg 330
280

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 18
84
Resilience: Unit (Modulus of Resilience), kJ/m3 59
250
Stiffness to Weight: Axial, points 7.0
8.6
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 7.6
15
Strength to Weight: Bending, points 9.8
16
Thermal Diffusivity, mm2/s 9.3
8.1
Thermal Shock Resistance, points 8.0
17

Alloy Composition


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Aluminum (Al), % 0 to 0.0050
0 to 0.010
Antimony (Sb), % 0 to 0.35
0
Bismuth (Bi), % 0
0 to 0.010
Boron (B), % 0
0 to 0.010
Cadmium (Cd), % 0
0 to 0.020
Carbon (C), % 0
0 to 0.030
Copper (Cu), % 53 to 58
64 to 69.1
Iron (Fe), % 0 to 1.5
0.5 to 1.5
Lead (Pb), % 8.0 to 11
0 to 0.010
Magnesium (Mg), % 0
0 to 0.010
Manganese (Mn), % 0
0.6 to 1.2
Nickel (Ni), % 11 to 14
29 to 31
Niobium (Nb), % 0
0.5 to 1.0
Phosphorus (P), % 0 to 0.050
0 to 0.010
Selenium (Se), % 0
0 to 0.010
Silicon (Si), % 0 to 0.15
0.3 to 0.7
Sulfur (S), % 0 to 0.080
0 to 0.010
Tellurium (Te), % 0
0 to 0.010
Tin (Sn), % 1.5 to 3.0
0
Zinc (Zn), % 17 to 25
0 to 0.5
Residuals, % 0 to 1.0
0