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C97300 Nickel Silver vs. C19500 Copper

Both C97300 nickel silver and C19500 copper are copper alloys. They have 57% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (3, in this case) are not shown.

For each property being compared, the top bar is C97300 nickel silver and the bottom bar is C19500 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 9.0
2.3 to 38
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 40
44
Tensile Strength: Ultimate (UTS), MPa 230
380 to 640
Tensile Strength: Yield (Proof), MPa 110
120 to 600

Thermal Properties

Latent Heat of Fusion, J/g 180
210
Maximum Temperature: Mechanical, °C 150
200
Melting Completion (Liquidus), °C 1040
1090
Melting Onset (Solidus), °C 1010
1090
Specific Heat Capacity, J/kg-K 370
390
Thermal Conductivity, W/m-K 29
200
Thermal Expansion, µm/m-K 19
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
50 to 56
Electrical Conductivity: Equal Weight (Specific), % IACS 6.3
50 to 57

Otherwise Unclassified Properties

Base Metal Price, % relative 30
31
Density, g/cm3 8.6
8.9
Embodied Carbon, kg CO2/kg material 3.7
2.7
Embodied Energy, MJ/kg 59
42
Embodied Water, L/kg 330
310

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 18
14 to 110
Resilience: Unit (Modulus of Resilience), kJ/m3 59
59 to 1530
Stiffness to Weight: Axial, points 7.0
7.3
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 7.6
12 to 20
Strength to Weight: Bending, points 9.8
13 to 18
Thermal Diffusivity, mm2/s 9.3
58
Thermal Shock Resistance, points 8.0
13 to 23

Alloy Composition


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Aluminum (Al), % 0 to 0.0050
0 to 0.020
Antimony (Sb), % 0 to 0.35
0
Cobalt (Co), % 0
0.3 to 1.3
Copper (Cu), % 53 to 58
94.9 to 98.6
Iron (Fe), % 0 to 1.5
1.0 to 2.0
Lead (Pb), % 8.0 to 11
0 to 0.020
Nickel (Ni), % 11 to 14
0
Phosphorus (P), % 0 to 0.050
0.010 to 0.35
Silicon (Si), % 0 to 0.15
0
Sulfur (S), % 0 to 0.080
0
Tin (Sn), % 1.5 to 3.0
0.1 to 1.0
Zinc (Zn), % 17 to 25
0 to 0.2
Residuals, % 0 to 1.0
0 to 0.2