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C97300 Nickel Silver vs. C72700 Copper-nickel

Both C97300 nickel silver and C72700 copper-nickel are copper alloys. They have 67% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C97300 nickel silver and the bottom bar is C72700 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 9.0
4.0 to 36
Poisson's Ratio 0.33
0.34
Shear Modulus, GPa 40
44
Tensile Strength: Ultimate (UTS), MPa 230
460 to 1070
Tensile Strength: Yield (Proof), MPa 110
580 to 1060

Thermal Properties

Latent Heat of Fusion, J/g 180
210
Maximum Temperature: Mechanical, °C 150
200
Melting Completion (Liquidus), °C 1040
1100
Melting Onset (Solidus), °C 1010
930
Specific Heat Capacity, J/kg-K 370
380
Thermal Conductivity, W/m-K 29
54
Thermal Expansion, µm/m-K 19
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
11
Electrical Conductivity: Equal Weight (Specific), % IACS 6.3
11

Otherwise Unclassified Properties

Base Metal Price, % relative 30
36
Density, g/cm3 8.6
8.8
Embodied Carbon, kg CO2/kg material 3.7
4.0
Embodied Energy, MJ/kg 59
62
Embodied Water, L/kg 330
350

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 18
20 to 380
Resilience: Unit (Modulus of Resilience), kJ/m3 59
1420 to 4770
Stiffness to Weight: Axial, points 7.0
7.4
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 7.6
14 to 34
Strength to Weight: Bending, points 9.8
15 to 26
Thermal Diffusivity, mm2/s 9.3
16
Thermal Shock Resistance, points 8.0
16 to 38

Alloy Composition


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Aluminum (Al), % 0 to 0.0050
0
Antimony (Sb), % 0 to 0.35
0
Copper (Cu), % 53 to 58
82.1 to 86
Iron (Fe), % 0 to 1.5
0 to 0.5
Lead (Pb), % 8.0 to 11
0 to 0.020
Magnesium (Mg), % 0
0 to 0.15
Manganese (Mn), % 0
0.050 to 0.3
Nickel (Ni), % 11 to 14
8.5 to 9.5
Niobium (Nb), % 0
0 to 0.1
Phosphorus (P), % 0 to 0.050
0
Silicon (Si), % 0 to 0.15
0
Sulfur (S), % 0 to 0.080
0
Tin (Sn), % 1.5 to 3.0
5.5 to 6.5
Zinc (Zn), % 17 to 25
0 to 0.5
Residuals, % 0 to 1.0
0 to 0.3