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C97300 Nickel Silver vs. C99300 Copper

Both C97300 nickel silver and C99300 copper are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 69% of their average alloy composition in common. There are 28 material properties with values for both materials. Properties with values for just one material (1, in this case) are not shown.

For each property being compared, the top bar is C97300 nickel silver and the bottom bar is C99300 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 110
120
Elongation at Break, % 9.0
2.0
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 40
46
Tensile Strength: Ultimate (UTS), MPa 230
660
Tensile Strength: Yield (Proof), MPa 110
380

Thermal Properties

Latent Heat of Fusion, J/g 180
240
Maximum Temperature: Mechanical, °C 150
250
Melting Completion (Liquidus), °C 1040
1080
Melting Onset (Solidus), °C 1010
1070
Specific Heat Capacity, J/kg-K 370
450
Thermal Conductivity, W/m-K 29
43
Thermal Expansion, µm/m-K 19
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 6.0
9.0
Electrical Conductivity: Equal Weight (Specific), % IACS 6.3
9.8

Otherwise Unclassified Properties

Base Metal Price, % relative 30
35
Density, g/cm3 8.6
8.2
Embodied Carbon, kg CO2/kg material 3.7
4.5
Embodied Energy, MJ/kg 59
70
Embodied Water, L/kg 330
400

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 18
11
Resilience: Unit (Modulus of Resilience), kJ/m3 59
590
Stiffness to Weight: Axial, points 7.0
8.3
Stiffness to Weight: Bending, points 18
20
Strength to Weight: Axial, points 7.6
22
Strength to Weight: Bending, points 9.8
20
Thermal Diffusivity, mm2/s 9.3
12
Thermal Shock Resistance, points 8.0
22

Alloy Composition


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Aluminum (Al), % 0 to 0.0050
10.7 to 11.5
Antimony (Sb), % 0 to 0.35
0
Cobalt (Co), % 0
1.0 to 2.0
Copper (Cu), % 53 to 58
68.6 to 74.4
Iron (Fe), % 0 to 1.5
0.4 to 1.0
Lead (Pb), % 8.0 to 11
0 to 0.020
Nickel (Ni), % 11 to 14
13.5 to 16.5
Phosphorus (P), % 0 to 0.050
0
Silicon (Si), % 0 to 0.15
0 to 0.020
Sulfur (S), % 0 to 0.080
0
Tin (Sn), % 1.5 to 3.0
0 to 0.050
Zinc (Zn), % 17 to 25
0
Residuals, % 0 to 1.0
0 to 0.3