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C99500 Copper vs. Solder Alloy 801

C99500 copper belongs to the copper alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 21 material properties with values for both materials. Properties with values for just one material (8, in this case) are not shown.

For each property being compared, the top bar is C99500 copper and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
53
Elongation at Break, % 13
33
Poisson's Ratio 0.34
0.35
Shear Modulus, GPa 45
20
Tensile Strength: Ultimate (UTS), MPa 540
55

Thermal Properties

Latent Heat of Fusion, J/g 240
64
Melting Completion (Liquidus), °C 1090
200
Melting Onset (Solidus), °C 1040
200
Specific Heat Capacity, J/kg-K 400
240
Thermal Expansion, µm/m-K 17
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
15
Electrical Conductivity: Equal Weight (Specific), % IACS 10
19

Otherwise Unclassified Properties

Density, g/cm3 8.7
7.2
Embodied Carbon, kg CO2/kg material 3.0
14
Embodied Energy, MJ/kg 47
240
Embodied Water, L/kg 300
1140

Common Calculations

Stiffness to Weight: Axial, points 7.7
4.1
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 17
2.1
Strength to Weight: Bending, points 17
4.4
Thermal Shock Resistance, points 19
3.3

Alloy Composition

Aluminum (Al), % 0.5 to 2.0
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 82.5 to 92
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 3.0 to 5.0
0 to 0.020
Lead (Pb), % 0 to 0.25
0 to 0.070
Manganese (Mn), % 0 to 0.5
0
Nickel (Ni), % 3.5 to 5.5
0 to 0.010
Silicon (Si), % 0.5 to 2.0
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0
89.9 to 91.5
Zinc (Zn), % 0.5 to 2.0
8.5 to 9.5
Residuals, % 0 to 0.3
0