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ZA-27 vs. Solder Alloy 801

ZA-27 belongs to the zinc alloys classification, while solder alloy 801 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (12, in this case) are not shown.

For each property being compared, the top bar is ZA-27 and the bottom bar is solder alloy 801.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 100 to 120
22
Elastic (Young's, Tensile) Modulus, GPa 78
53
Elongation at Break, % 2.0 to 4.5
33
Poisson's Ratio 0.27
0.35
Shear Modulus, GPa 31
20
Tensile Strength: Ultimate (UTS), MPa 400 to 430
55

Thermal Properties

Latent Heat of Fusion, J/g 130
64
Melting Completion (Liquidus), °C 480
200
Melting Onset (Solidus), °C 380
200
Specific Heat Capacity, J/kg-K 530
240
Thermal Conductivity, W/m-K 130
61
Thermal Expansion, µm/m-K 26
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 30
15
Electrical Conductivity: Equal Weight (Specific), % IACS 53
19

Otherwise Unclassified Properties

Density, g/cm3 5.0
7.2
Embodied Carbon, kg CO2/kg material 4.2
14
Embodied Energy, MJ/kg 80
240
Embodied Water, L/kg 570
1140

Common Calculations

Stiffness to Weight: Axial, points 8.6
4.1
Stiffness to Weight: Bending, points 28
17
Strength to Weight: Axial, points 22 to 24
2.1
Strength to Weight: Bending, points 24 to 25
4.4
Thermal Diffusivity, mm2/s 47
36
Thermal Shock Resistance, points 14 to 15
3.3

Alloy Composition

Aluminum (Al), % 25 to 28
0 to 0.0010
Antimony (Sb), % 0
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.1
Cadmium (Cd), % 0 to 0.0060
0 to 0.0020
Copper (Cu), % 2.0 to 2.5
0 to 0.050
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0 to 0.1
0 to 0.020
Lead (Pb), % 0 to 0.0060
0 to 0.070
Magnesium (Mg), % 0.010 to 0.020
0
Nickel (Ni), % 0 to 0.020
0 to 0.010
Silicon (Si), % 0 to 0.080
0
Silver (Ag), % 0
0 to 0.1
Tin (Sn), % 0 to 0.0030
89.9 to 91.5
Zinc (Zn), % 69.3 to 73
8.5 to 9.5