Half-Hard (H02) C14300 Copper
H02 C14300 copper is C14300 copper in the H02 (half hard) temper. It has the second lowest strength and second highest ductility compared to the other variants of C14300 copper. The graph bars on the material properties cards below compare H02 C14300 copper to: wrought coppers (top), all copper alloys (middle), and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.
Mechanical Properties
Elastic (Young's, Tensile) Modulus
120 GPa 17 x 106 psi
Elongation at Break
14 %
Poisson's Ratio
0.34
Shear Modulus
43 GPa 6.3 x 106 psi
Shear Strength
190 MPa 27 x 103 psi
Tensile Strength: Ultimate (UTS)
310 MPa 45 x 103 psi
Tensile Strength: Yield (Proof)
280 MPa 40 x 103 psi
Thermal Properties
Latent Heat of Fusion
210 J/g
Maximum Temperature: Mechanical
220 °C 420 °F
Melting Completion (Liquidus)
1080 °C 1980 °F
Melting Onset (Solidus)
1050 °C 1930 °F
Specific Heat Capacity
390 J/kg-K 0.092 BTU/lb-°F
Thermal Conductivity
380 W/m-K 220 BTU/h-ft-°F
Thermal Expansion
17 µm/m-K
Electrical Properties
Electrical Conductivity: Equal Volume
96 % IACS
Electrical Conductivity: Equal Weight (Specific)
96 % IACS
Otherwise Unclassified Properties
Base Metal Price
31 % relative
Density
9.0 g/cm3 560 lb/ft3
Embodied Carbon
2.6 kg CO2/kg material
Embodied Energy
41 MJ/kg 18 x 103 BTU/lb
Embodied Water
310 L/kg 37 gal/lb
Common Calculations
Resilience: Ultimate (Unit Rupture Work)
42 MJ/m3
Resilience: Unit (Modulus of Resilience)
330 kJ/m3
Stiffness to Weight: Axial
7.2 points
Stiffness to Weight: Bending
18 points
Strength to Weight: Axial
9.6 points
Strength to Weight: Bending
11 points
Thermal Diffusivity
110 mm2/s
Thermal Shock Resistance
11 points
Alloy Composition
| Cu | 99.9 to 99.95 | |
| Cd | 0.050 to 0.15 |
All values are % weight. Ranges represent what is permitted under applicable standards.
Followup Questions
Further Reading
CRC Materials Science and Engineering Handbook, 4th ed., James F. Shackelford et al. (editors), 2015