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Hard-Drawn (H80) C27200 Brass

H80 C27200 brass is C27200 brass in the H80 (hard drawn) temper. It has the lowest ductility compared to the other variants of C27200 brass. The graph bars on the material properties cards below compare H80 C27200 brass to: wrought brasses (top), all copper alloys (middle), and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.

Mechanical Properties

Elastic (Young's, Tensile) Modulus

110 GPa 15 x 106 psi

Elongation at Break

10 %

Poisson's Ratio

0.31

Rockwell F Hardness

80

Shear Modulus

40 GPa 5.8 x 106 psi

Shear Strength

300 MPa 44 x 103 psi

Tensile Strength: Ultimate (UTS)

510 MPa 74 x 103 psi

Tensile Strength: Yield (Proof)

410 MPa 60 x 103 psi

Thermal Properties

Latent Heat of Fusion

170 J/g

Maximum Temperature: Mechanical

130 °C 260 °F

Melting Completion (Liquidus)

920 °C 1680 °F

Melting Onset (Solidus)

870 °C 1600 °F

Specific Heat Capacity

390 J/kg-K 0.092 BTU/lb-°F

Thermal Conductivity

120 W/m-K 67 BTU/h-ft-°F

Thermal Expansion

20 µm/m-K

Electrical Properties

Electrical Conductivity: Equal Volume

28 % IACS

Electrical Conductivity: Equal Weight (Specific)

31 % IACS

Otherwise Unclassified Properties

Base Metal Price

24 % relative

Density

8.1 g/cm3 500 lb/ft3

Embodied Carbon

2.7 kg CO2/kg material

Embodied Energy

45 MJ/kg 19 x 103 BTU/lb

Embodied Water

320 L/kg 38 gal/lb

Common Calculations

Resilience: Ultimate (Unit Rupture Work)

48 MJ/m3

Resilience: Unit (Modulus of Resilience)

810 kJ/m3

Stiffness to Weight: Axial

7.2 points

Stiffness to Weight: Bending

19 points

Strength to Weight: Axial

18 points

Strength to Weight: Bending

18 points

Thermal Diffusivity

37 mm2/s

Thermal Shock Resistance

17 points

Alloy Composition

Copper (Cu)Cu 62 to 65
Zinc (Zn)Zn 34.6 to 38
Iron (Fe)Fe 0 to 0.070
Lead (Pb)Pb 0 to 0.070
Residualsres. 0 to 0.3

All values are % weight. Ranges represent what is permitted under applicable standards.

Followup Questions