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Light Drawn (H55) C10500 Copper

H55 C10500 copper is C10500 copper in the H55 (light drawn) temper. The graph bars on the material properties cards below compare H55 C10500 copper to: wrought coppers (top), all copper alloys (middle), and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.

Mechanical Properties

Elastic (Young's, Tensile) Modulus

120 GPa 17 x 106 psi

Elongation at Break

25 %

Poisson's Ratio

0.34

Rockwell B Hardness

35

Rockwell F Hardness

77

Rockwell Superficial 30T Hardness

45

Shear Modulus

43 GPa 6.3 x 106 psi

Shear Strength

180 MPa 26 x 103 psi

Tensile Strength: Ultimate (UTS)

280 MPa 40 x 103 psi

Tensile Strength: Yield (Proof)

240 MPa 35 x 103 psi

Thermal Properties

Latent Heat of Fusion

210 J/g

Maximum Temperature: Mechanical

200 °C 390 °F

Melting Completion (Liquidus)

1080 °C 1980 °F

Melting Onset (Solidus)

1080 °C 1980 °F

Specific Heat Capacity

390 J/kg-K 0.092 BTU/lb-°F

Thermal Conductivity

390 W/m-K 220 BTU/h-ft-°F

Thermal Expansion

17 µm/m-K

Electrical Properties

Electrical Conductivity: Equal Volume

100 % IACS

Electrical Conductivity: Equal Weight (Specific)

100 % IACS

Otherwise Unclassified Properties

Base Metal Price

32 % relative

Density

9.0 g/cm3 560 lb/ft3

Embodied Carbon

2.6 kg CO2/kg material

Embodied Energy

42 MJ/kg 18 x 103 BTU/lb

Embodied Water

350 L/kg 41 gal/lb

Common Calculations

Resilience: Ultimate (Unit Rupture Work)

66 MJ/m3

Resilience: Unit (Modulus of Resilience)

250 kJ/m3

Stiffness to Weight: Axial

7.2 points

Stiffness to Weight: Bending

18 points

Strength to Weight: Axial

8.6 points

Strength to Weight: Bending

11 points

Thermal Diffusivity

110 mm2/s

Thermal Shock Resistance

9.8 points

Alloy Composition

Copper (Cu)Cu 99.89 to 99.966
Silver (Ag)Ag 0.034 to 0.060
Oxygen (O)O 0 to 0.0010
Residualsres. 0 to 0.050

All values are % weight. Ranges represent what is permitted under applicable standards.

Followup Questions