Menu (ESC)

Reaction Bonded Silicon Nitride (IEC 60672 Type C-930)

Reaction bonded silicon nitride is a grade of silicon nitride. The graph bars on the material properties cards below compare reaction bonded silicon nitride to other non-oxide engineering ceramics (top) and the entire database (bottom). A full bar means this is the highest value in the relevant set. A half-full bar means it's 50% of the highest, and so on.

Mechanical Properties

Compressive (Crushing) Strength

600 MPa 87 x 103 psi

Elastic (Young's, Tensile) Modulus

140 GPa 20 x 106 psi

Flexural Strength

130 MPa 18 x 103 psi

Fracture Toughness

3.1 MPa-m1/2 2.9 x 103 psi-in1/2

Poisson's Ratio


Tensile Strength: Ultimate (UTS)

230 MPa 33 x 103 psi

Electrical Properties

Dielectric Constant (Relative Permittivity) At 1 MHz


Dielectric Strength (Breakdown Potential)

18 kV/mm 0.7 V/mil

Electrical Dissipation At 1 Hz


Electrical Dissipation At 1 MHz


Electrical Resistivity Order of Magnitude

11 10x Ω-m

Other Material Properties


2.2 g/cm3 140 lb/ft3

Maximum Temperature: Mechanical

1210 °C 2210 °F

Maximum Thermal Shock

420 °C 790 °F

Specific Heat Capacity

730 J/kg-K 0.17 BTU/lb-°F

Thermal Conductivity

12 W/m-K 7.0 BTU/h-ft-°F

Thermal Expansion

2.6 µm/m-K

Common Calculations

Stiffness to Weight: Axial

34 points

Stiffness to Weight: Bending

78 points

Strength to Weight: Axial

29 points

Strength to Weight: Bending

37 points

Thermal Diffusivity

7.5 mm2/s

Thermal Shock Resistance

46 points

Followup Questions

Further Reading

Silicon Nitride and the Sialons, Vivien Mitchell, 1993

Handbook of Refractory Carbides and Nitrides: Properties, Characteristics, Processing and Applications, Hugh O. Pierson, 1996

IEC 60672-3: Ceramic and glass-insulating materials - Part 3: Specifications for individual materials

Springer Handbook of Condensed Matter and Materials Data, W. Martienssen and H. Warlimont (editors), 2005

Sintering of Advanced Materials: Fundamentals and Processes, Zhigang Zak Fang (editor), 2010