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TB00 C15000 Copper vs. TB00 C72800 Copper-nickel

Both TB00 C15000 copper and TB00 C72800 copper-nickel are copper alloys. Both are furnished in the TB00 (solution heat treated) temper. They have 81% of their average alloy composition in common.

For each property being compared, the top bar is TB00 C15000 copper and the bottom bar is TB00 C72800 copper-nickel.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 54
23
Poisson's Ratio 0.34
0.34
Shear Modulus, GPa 43
44
Shear Strength, MPa 150
330
Tensile Strength: Ultimate (UTS), MPa 200
520
Tensile Strength: Yield (Proof), MPa 45
250

Thermal Properties

Latent Heat of Fusion, J/g 210
210
Maximum Temperature: Mechanical, °C 200
200
Melting Completion (Liquidus), °C 1080
1080
Melting Onset (Solidus), °C 980
920
Specific Heat Capacity, J/kg-K 390
380
Thermal Conductivity, W/m-K 370
55
Thermal Expansion, µm/m-K 17
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 93
11
Electrical Conductivity: Equal Weight (Specific), % IACS 93
11

Otherwise Unclassified Properties

Base Metal Price, % relative 31
38
Density, g/cm3 9.0
8.8
Embodied Carbon, kg CO2/kg material 2.7
4.4
Embodied Energy, MJ/kg 43
68
Embodied Water, L/kg 310
360

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 80
99
Resilience: Unit (Modulus of Resilience), kJ/m3 8.7
260
Stiffness to Weight: Axial, points 7.2
7.4
Stiffness to Weight: Bending, points 18
19
Strength to Weight: Axial, points 6.2
17
Strength to Weight: Bending, points 8.5
16
Thermal Diffusivity, mm2/s 110
17
Thermal Shock Resistance, points 7.3
19

Alloy Composition


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Aluminum (Al), % 0
0 to 0.1
Antimony (Sb), % 0
0 to 0.020
Bismuth (Bi), % 0
0 to 0.0010
Boron (B), % 0
0 to 0.0010
Copper (Cu), % 99.8 to 99.9
78.3 to 82.8
Iron (Fe), % 0
0 to 0.5
Lead (Pb), % 0
0 to 0.0050
Magnesium (Mg), % 0
0.0050 to 0.15
Manganese (Mn), % 0
0.050 to 0.3
Nickel (Ni), % 0
9.5 to 10.5
Niobium (Nb), % 0
0.1 to 0.3
Phosphorus (P), % 0
0 to 0.0050
Silicon (Si), % 0
0 to 0.050
Sulfur (S), % 0
0 to 0.0025
Tin (Sn), % 0
7.5 to 8.5
Titanium (Ti), % 0
0 to 0.010
Zinc (Zn), % 0
0 to 1.0
Zirconium (Zr), % 0.1 to 0.2
0
Residuals, % 0
0 to 0.3