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CC382H Copper-nickel vs. C97400 Nickel Silver

Both CC382H copper-nickel and C97400 nickel silver are copper alloys. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 77% of their average alloy composition in common.

For each property being compared, the top bar is CC382H copper-nickel and the bottom bar is C97400 nickel silver.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 130
70
Elastic (Young's, Tensile) Modulus, GPa 140
120
Elongation at Break, % 20
20
Poisson's Ratio 0.33
0.33
Shear Modulus, GPa 53
44
Tensile Strength: Ultimate (UTS), MPa 490
260
Tensile Strength: Yield (Proof), MPa 290
120

Thermal Properties

Latent Heat of Fusion, J/g 240
190
Maximum Temperature: Mechanical, °C 260
180
Melting Completion (Liquidus), °C 1180
1100
Melting Onset (Solidus), °C 1120
1070
Specific Heat Capacity, J/kg-K 410
380
Thermal Conductivity, W/m-K 30
27
Thermal Expansion, µm/m-K 15
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 5.5
6.0
Electrical Conductivity: Equal Weight (Specific), % IACS 5.6
6.3

Otherwise Unclassified Properties

Base Metal Price, % relative 41
33
Density, g/cm3 8.9
8.6
Embodied Carbon, kg CO2/kg material 5.2
4.1
Embodied Energy, MJ/kg 76
64
Embodied Water, L/kg 290
320

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 85
43
Resilience: Unit (Modulus of Resilience), kJ/m3 290
59
Stiffness to Weight: Axial, points 8.8
7.5
Stiffness to Weight: Bending, points 20
19
Strength to Weight: Axial, points 15
8.5
Strength to Weight: Bending, points 16
11
Thermal Diffusivity, mm2/s 8.2
8.3
Thermal Shock Resistance, points 16
8.8

Alloy Composition


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Aluminum (Al), % 0 to 0.010
0
Bismuth (Bi), % 0 to 0.0020
0
Boron (B), % 0 to 0.010
0
Carbon (C), % 0 to 0.030
0
Chromium (Cr), % 1.5 to 2.0
0
Copper (Cu), % 62.8 to 68.4
58 to 61
Iron (Fe), % 0.5 to 1.0
0 to 1.5
Lead (Pb), % 0 to 0.0050
4.5 to 5.5
Magnesium (Mg), % 0 to 0.010
0
Manganese (Mn), % 0.5 to 1.0
0 to 0.5
Nickel (Ni), % 29 to 32
15.5 to 17
Phosphorus (P), % 0 to 0.010
0
Selenium (Se), % 0 to 0.0050
0
Silicon (Si), % 0.15 to 0.5
0
Sulfur (S), % 0 to 0.010
0
Tellurium (Te), % 0 to 0.0050
0
Tin (Sn), % 0
2.5 to 3.5
Titanium (Ti), % 0 to 0.25
0
Zinc (Zn), % 0 to 0.2
10 to 19.5
Zirconium (Zr), % 0 to 0.15
0
Residuals, % 0
0 to 1.0