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CC751S Brass vs. Solder Alloy 501

CC751S brass belongs to the copper alloys classification, while solder alloy 501 belongs to the otherwise unclassified metals. There are 24 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is CC751S brass and the bottom bar is solder alloy 501.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 130
14
Elastic (Young's, Tensile) Modulus, GPa 110
51
Elongation at Break, % 5.6
22
Poisson's Ratio 0.31
0.36
Shear Modulus, GPa 40
19
Tensile Strength: Ultimate (UTS), MPa 450
29

Thermal Properties

Latent Heat of Fusion, J/g 190
60
Melting Completion (Liquidus), °C 850
230
Melting Onset (Solidus), °C 810
220
Specific Heat Capacity, J/kg-K 390
220
Thermal Conductivity, W/m-K 110
67
Thermal Expansion, µm/m-K 20
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 25
14
Electrical Conductivity: Equal Weight (Specific), % IACS 28
17

Otherwise Unclassified Properties

Density, g/cm3 8.1
7.3
Embodied Carbon, kg CO2/kg material 2.8
15
Embodied Energy, MJ/kg 46
260
Embodied Water, L/kg 330
1390

Common Calculations

Stiffness to Weight: Axial, points 7.2
3.8
Stiffness to Weight: Bending, points 19
17
Strength to Weight: Axial, points 15
1.1
Strength to Weight: Bending, points 16
2.9
Thermal Diffusivity, mm2/s 35
41
Thermal Shock Resistance, points 15
1.9

Alloy Composition

Aluminum (Al), % 0 to 0.1
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.1
Arsenic (As), % 0
0 to 0.030
Bismuth (Bi), % 0
0 to 0.060
Cadmium (Cd), % 0
0 to 0.0020
Copper (Cu), % 62.7 to 66
0.5 to 0.9
Gold (Au), % 0
0 to 0.050
Indium (In), % 0
0 to 0.1
Iron (Fe), % 0.25 to 0.5
0 to 0.020
Lead (Pb), % 0.8 to 2.2
0 to 0.070
Manganese (Mn), % 0 to 0.15
0
Nickel (Ni), % 0 to 0.8
0 to 0.010
Silicon (Si), % 0.65 to 1.1
0
Silver (Ag), % 0
0.2 to 0.4
Tin (Sn), % 0 to 0.8
98.3 to 99.3
Zinc (Zn), % 27.9 to 35.6
0 to 0.0010