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H04 C12900 Copper vs. H04 C65100 Bronze

Both H04 C12900 copper and H04 C65100 bronze are copper alloys. Both are furnished in the H04 (full hard) temper. They have a very high 97% of their average alloy composition in common. There are 30 material properties with values for both materials. Properties with values for just one material (4, in this case) are not shown.

For each property being compared, the top bar is H04 C12900 copper and the bottom bar is H04 C65100 bronze.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 120
120
Elongation at Break, % 13
12
Poisson's Ratio 0.34
0.34
Rockwell B Hardness 44
79
Shear Modulus, GPa 43
43
Shear Strength, MPa 190
310
Tensile Strength: Ultimate (UTS), MPa 330
480
Tensile Strength: Yield (Proof), MPa 320
330

Thermal Properties

Latent Heat of Fusion, J/g 210
230
Maximum Temperature: Mechanical, °C 200
200
Melting Completion (Liquidus), °C 1080
1060
Melting Onset (Solidus), °C 1030
1030
Specific Heat Capacity, J/kg-K 390
390
Thermal Conductivity, W/m-K 380
57
Thermal Expansion, µm/m-K 17
18

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 98
12
Electrical Conductivity: Equal Weight (Specific), % IACS 98
12

Otherwise Unclassified Properties

Base Metal Price, % relative 32
30
Density, g/cm3 9.0
8.8
Embodied Carbon, kg CO2/kg material 2.6
2.6
Embodied Energy, MJ/kg 41
41
Embodied Water, L/kg 330
300

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 44
51
Resilience: Unit (Modulus of Resilience), kJ/m3 430
460
Stiffness to Weight: Axial, points 7.2
7.3
Stiffness to Weight: Bending, points 18
18
Strength to Weight: Axial, points 10
15
Strength to Weight: Bending, points 12
15
Thermal Diffusivity, mm2/s 110
16
Thermal Shock Resistance, points 12
17

Alloy Composition


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Antimony (Sb), % 0 to 0.0030
0
Arsenic (As), % 0 to 0.012
0
Bismuth (Bi), % 0 to 0.0030
0
Copper (Cu), % 99.88 to 100
94.5 to 99.2
Iron (Fe), % 0
0 to 0.8
Lead (Pb), % 0 to 0.0040
0 to 0.050
Manganese (Mn), % 0
0 to 0.7
Nickel (Ni), % 0 to 0.050
0
Silicon (Si), % 0
0.8 to 2.0
Silver (Ag), % 0 to 0.054
0
Tellurium (Te), % 0 to 0.025
0
Zinc (Zn), % 0
0 to 1.5
Residuals, % 0
0 to 0.5