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Grade M35-1 Nickel vs. C11400 Copper

Grade M35-1 nickel belongs to the nickel alloys classification, while C11400 copper belongs to the copper alloys. They have a modest 30% of their average alloy composition in common, which, by itself, doesn't mean much. There are 28 material properties with values for both materials. Properties with values for just one material (5, in this case) are not shown.

For each property being compared, the top bar is grade M35-1 nickel and the bottom bar is C11400 copper.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 160
120
Elongation at Break, % 28
2.8 to 51
Poisson's Ratio 0.32
0.34
Shear Modulus, GPa 62
43
Tensile Strength: Ultimate (UTS), MPa 500
220 to 400
Tensile Strength: Yield (Proof), MPa 190
75 to 400

Thermal Properties

Latent Heat of Fusion, J/g 280
210
Maximum Temperature: Mechanical, °C 900
200
Melting Completion (Liquidus), °C 1280
1080
Melting Onset (Solidus), °C 1240
1030
Specific Heat Capacity, J/kg-K 430
390
Thermal Conductivity, W/m-K 22
390
Thermal Expansion, µm/m-K 13
17

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 3.3
100
Electrical Conductivity: Equal Weight (Specific), % IACS 3.4
100

Otherwise Unclassified Properties

Base Metal Price, % relative 55
32
Density, g/cm3 8.8
9.0
Embodied Carbon, kg CO2/kg material 8.2
2.6
Embodied Energy, MJ/kg 120
42
Embodied Water, L/kg 250
350

Common Calculations

Resilience: Ultimate (Unit Rupture Work), MJ/m3 110
11 to 90
Resilience: Unit (Modulus of Resilience), kJ/m3 120
24 to 680
Stiffness to Weight: Axial, points 10
7.2
Stiffness to Weight: Bending, points 21
18
Strength to Weight: Axial, points 16
6.8 to 12
Strength to Weight: Bending, points 16
9.1 to 14
Thermal Diffusivity, mm2/s 5.7
110
Thermal Shock Resistance, points 17
7.8 to 14

Alloy Composition


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Carbon (C), % 0 to 0.35
0
Copper (Cu), % 26 to 33
99.84 to 99.966
Iron (Fe), % 0 to 3.5
0
Manganese (Mn), % 0 to 1.5
0
Nickel (Ni), % 59.8 to 74
0
Niobium (Nb), % 0 to 0.5
0
Phosphorus (P), % 0 to 0.030
0
Silicon (Si), % 0 to 1.3
0
Silver (Ag), % 0
0.034 to 0.060
Sulfur (S), % 0 to 0.030
0
Residuals, % 0
0 to 0.1