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Solder Alloy 111 vs. Solder Alloy 501

Both solder alloy 111 and solder alloy 501 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 50% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 111 and the bottom bar is solder alloy 501.

Metric UnitsUS Customary Units

Mechanical Properties

Brinell Hardness 14
14
Elastic (Young's, Tensile) Modulus, GPa 33
51
Elongation at Break, % 35
22
Poisson's Ratio 0.4
0.36
Shear Modulus, GPa 12
19
Tensile Strength: Ultimate (UTS), MPa 41
29

Thermal Properties

Latent Heat of Fusion, J/g 41
60
Melting Completion (Liquidus), °C 220
230
Melting Onset (Solidus), °C 180
220
Specific Heat Capacity, J/kg-K 180
220
Thermal Conductivity, W/m-K 48
67
Thermal Expansion, µm/m-K 26
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 11
14
Electrical Conductivity: Equal Weight (Specific), % IACS 11
17

Otherwise Unclassified Properties

Density, g/cm3 9.3
7.3
Embodied Carbon, kg CO2/kg material 9.4
15
Embodied Energy, MJ/kg 160
260
Embodied Water, L/kg 830
1390

Common Calculations

Stiffness to Weight: Axial, points 2.0
3.8
Stiffness to Weight: Bending, points 12
17
Strength to Weight: Axial, points 1.2
1.1
Strength to Weight: Bending, points 2.8
2.9
Thermal Diffusivity, mm2/s 29
41
Thermal Shock Resistance, points 3.5
1.9

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.2
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.1
0 to 0.060
Cadmium (Cd), % 0 to 0.0020
0 to 0.0020
Copper (Cu), % 0 to 0.080
0.5 to 0.9
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 48.8 to 50.5
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0.2 to 0.4
Tin (Sn), % 49.5 to 50.5
98.3 to 99.3
Zinc (Zn), % 0 to 0.0010
0 to 0.0010