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Solder Alloy 113 vs. Solder Alloy 811

Both solder alloy 113 and solder alloy 811 are otherwise unclassified metals. Both are furnished in the as-fabricated (no temper or treatment) condition. They have 45% of their average alloy composition in common.

For each property being compared, the top bar is solder alloy 113 and the bottom bar is solder alloy 811.

Metric UnitsUS Customary Units

Mechanical Properties

Elastic (Young's, Tensile) Modulus, GPa 32
52
Elongation at Break, % 32
38
Poisson's Ratio 0.4
0.35
Shear Modulus, GPa 11
19
Tensile Strength: Ultimate (UTS), MPa 39
53

Thermal Properties

Latent Heat of Fusion, J/g 40
63
Melting Completion (Liquidus), °C 230
200
Melting Onset (Solidus), °C 180
190
Specific Heat Capacity, J/kg-K 170
230
Thermal Conductivity, W/m-K 46
59
Thermal Expansion, µm/m-K 26
22

Electrical Properties

Electrical Conductivity: Equal Volume, % IACS 10
14
Electrical Conductivity: Equal Weight (Specific), % IACS 9.8
17

Otherwise Unclassified Properties

Density, g/cm3 9.5
7.3
Embodied Carbon, kg CO2/kg material 8.9
14
Embodied Energy, MJ/kg 150
240
Embodied Water, L/kg 800
1200

Common Calculations

Stiffness to Weight: Axial, points 1.8
4.0
Stiffness to Weight: Bending, points 11
17
Strength to Weight: Axial, points 1.1
2.0
Strength to Weight: Bending, points 2.7
4.3
Thermal Diffusivity, mm2/s 28
35
Thermal Shock Resistance, points 3.4
3.3

Alloy Composition

Aluminum (Al), % 0 to 0.0010
0 to 0.0010
Antimony (Sb), % 0 to 0.5
0 to 0.1
Arsenic (As), % 0 to 0.030
0 to 0.030
Bismuth (Bi), % 0 to 0.25
2.8 to 3.2
Cadmium (Cd), % 0 to 0.0050
0 to 0.0020
Copper (Cu), % 0 to 0.080
0 to 0.050
Gold (Au), % 0 to 0.050
0 to 0.050
Indium (In), % 0 to 0.1
0 to 0.1
Iron (Fe), % 0 to 0.020
0 to 0.020
Lead (Pb), % 53.4 to 55.5
0 to 0.070
Nickel (Ni), % 0 to 0.010
0 to 0.010
Silver (Ag), % 0 to 0.1
0 to 0.1
Tin (Sn), % 44.5 to 45.5
87.8 to 89.7
Zinc (Zn), % 0 to 0.0010
7.5 to 8.5